JPS6348156B2 - - Google Patents
Info
- Publication number
- JPS6348156B2 JPS6348156B2 JP24119683A JP24119683A JPS6348156B2 JP S6348156 B2 JPS6348156 B2 JP S6348156B2 JP 24119683 A JP24119683 A JP 24119683A JP 24119683 A JP24119683 A JP 24119683A JP S6348156 B2 JPS6348156 B2 JP S6348156B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conductive
- conductive layer
- resin
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Electric Cables (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24119683A JPS60133682A (ja) | 1983-12-21 | 1983-12-21 | 熱融着型接続ケ−ブルの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24119683A JPS60133682A (ja) | 1983-12-21 | 1983-12-21 | 熱融着型接続ケ−ブルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60133682A JPS60133682A (ja) | 1985-07-16 |
JPS6348156B2 true JPS6348156B2 (en:Method) | 1988-09-27 |
Family
ID=17070634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24119683A Granted JPS60133682A (ja) | 1983-12-21 | 1983-12-21 | 熱融着型接続ケ−ブルの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60133682A (en:Method) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60140685A (ja) * | 1983-12-28 | 1985-07-25 | 日本写真印刷株式会社 | フイルム状電極コネクタ及びその製造方法 |
JPH0793155B2 (ja) * | 1991-12-26 | 1995-10-09 | 信越ポリマー株式会社 | ヒートシールコネクター及びこれと電気回路基板の接続構造 |
-
1983
- 1983-12-21 JP JP24119683A patent/JPS60133682A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60133682A (ja) | 1985-07-16 |
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