JPS6347268B2 - - Google Patents
Info
- Publication number
- JPS6347268B2 JPS6347268B2 JP57024826A JP2482682A JPS6347268B2 JP S6347268 B2 JPS6347268 B2 JP S6347268B2 JP 57024826 A JP57024826 A JP 57024826A JP 2482682 A JP2482682 A JP 2482682A JP S6347268 B2 JPS6347268 B2 JP S6347268B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead frame
- properties
- less
- frame material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57024826A JPS58141547A (ja) | 1982-02-18 | 1982-02-18 | リ−ドフレ−ム材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57024826A JPS58141547A (ja) | 1982-02-18 | 1982-02-18 | リ−ドフレ−ム材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58141547A JPS58141547A (ja) | 1983-08-22 |
| JPS6347268B2 true JPS6347268B2 (enExample) | 1988-09-21 |
Family
ID=12148983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57024826A Granted JPS58141547A (ja) | 1982-02-18 | 1982-02-18 | リ−ドフレ−ム材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58141547A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63105959A (ja) * | 1986-10-22 | 1988-05-11 | Nippon Steel Corp | 耐食性、はんだ性、密着性にすぐれたリ−ドフレ−ム用表面処理鋼板 |
| JP7175659B2 (ja) * | 2018-07-25 | 2022-11-21 | 株式会社日立製作所 | 複合金属材料、その製造方法、および複合金属材料を用いた電子装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897853A (ja) * | 1981-12-07 | 1983-06-10 | Hitachi Metals Ltd | Icリ−ドフレ−ム材料 |
-
1982
- 1982-02-18 JP JP57024826A patent/JPS58141547A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58141547A (ja) | 1983-08-22 |
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