JPS58141547A - リ−ドフレ−ム材料 - Google Patents

リ−ドフレ−ム材料

Info

Publication number
JPS58141547A
JPS58141547A JP57024826A JP2482682A JPS58141547A JP S58141547 A JPS58141547 A JP S58141547A JP 57024826 A JP57024826 A JP 57024826A JP 2482682 A JP2482682 A JP 2482682A JP S58141547 A JPS58141547 A JP S58141547A
Authority
JP
Japan
Prior art keywords
lead frame
transformation
generated
alloy
degraded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57024826A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347268B2 (enExample
Inventor
Shinichiro Yahagi
慎一郎 矢萩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP57024826A priority Critical patent/JPS58141547A/ja
Publication of JPS58141547A publication Critical patent/JPS58141547A/ja
Publication of JPS6347268B2 publication Critical patent/JPS6347268B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57024826A 1982-02-18 1982-02-18 リ−ドフレ−ム材料 Granted JPS58141547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57024826A JPS58141547A (ja) 1982-02-18 1982-02-18 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57024826A JPS58141547A (ja) 1982-02-18 1982-02-18 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS58141547A true JPS58141547A (ja) 1983-08-22
JPS6347268B2 JPS6347268B2 (enExample) 1988-09-21

Family

ID=12148983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57024826A Granted JPS58141547A (ja) 1982-02-18 1982-02-18 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS58141547A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105959A (ja) * 1986-10-22 1988-05-11 Nippon Steel Corp 耐食性、はんだ性、密着性にすぐれたリ−ドフレ−ム用表面処理鋼板
JP2020015948A (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897853A (ja) * 1981-12-07 1983-06-10 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897853A (ja) * 1981-12-07 1983-06-10 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105959A (ja) * 1986-10-22 1988-05-11 Nippon Steel Corp 耐食性、はんだ性、密着性にすぐれたリ−ドフレ−ム用表面処理鋼板
JP2020015948A (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置
WO2020021790A1 (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置

Also Published As

Publication number Publication date
JPS6347268B2 (enExample) 1988-09-21

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