JPS6345049B2 - - Google Patents
Info
- Publication number
- JPS6345049B2 JPS6345049B2 JP54167467A JP16746779A JPS6345049B2 JP S6345049 B2 JPS6345049 B2 JP S6345049B2 JP 54167467 A JP54167467 A JP 54167467A JP 16746779 A JP16746779 A JP 16746779A JP S6345049 B2 JPS6345049 B2 JP S6345049B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- substrate
- cavity
- saw
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 3
- 238000010897 surface acoustic wave method Methods 0.000 description 39
- 239000000463 material Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 238000005382 thermal cycling Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
- G01L9/0025—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element with acoustic surface waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97254278A | 1978-12-22 | 1978-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5598323A JPS5598323A (en) | 1980-07-26 |
| JPS6345049B2 true JPS6345049B2 (it) | 1988-09-07 |
Family
ID=25519783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16746779A Granted JPS5598323A (en) | 1978-12-22 | 1979-12-21 | Vacuummsealed structure for saw pressure sensor |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS5598323A (it) |
| AU (1) | AU524762B2 (it) |
| CA (1) | CA1126975A (it) |
| DE (1) | DE2951469A1 (it) |
| FR (1) | FR2444936A1 (it) |
| GB (1) | GB2037988B (it) |
| IT (1) | IT1125925B (it) |
| SE (1) | SE7910311L (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008070241A (ja) * | 2006-09-14 | 2008-03-27 | Epson Toyocom Corp | 圧力センサ、及びその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0329019D0 (en) | 2003-12-15 | 2004-01-14 | Imp College Innovations Ltd | Acoustic wave devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149992A (en) * | 1976-06-09 | 1977-12-13 | Hitachi Ltd | Pressure transducer |
| JPS5365089A (en) * | 1976-11-24 | 1978-06-10 | Toshiba Corp | Semiconductor pressure transducer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3697917A (en) * | 1971-08-02 | 1972-10-10 | Gen Electric | Semiconductor strain gage pressure transducer |
| GB1389610A (en) * | 1972-10-11 | 1975-04-03 | Marconi Co Ltd | Surfacewave devices |
| US4100811A (en) * | 1977-03-18 | 1978-07-18 | United Technologies Corporation | Differential surface acoustic wave transducer |
| US4216401A (en) * | 1978-12-22 | 1980-08-05 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
-
1979
- 1979-12-11 CA CA341,637A patent/CA1126975A/en not_active Expired
- 1979-12-13 AU AU53797/79A patent/AU524762B2/en not_active Ceased
- 1979-12-14 SE SE7910311A patent/SE7910311L/ not_active Application Discontinuation
- 1979-12-17 GB GB7943332A patent/GB2037988B/en not_active Expired
- 1979-12-18 IT IT28110/79A patent/IT1125925B/it active
- 1979-12-20 DE DE19792951469 patent/DE2951469A1/de not_active Withdrawn
- 1979-12-21 JP JP16746779A patent/JPS5598323A/ja active Granted
- 1979-12-24 FR FR7931570A patent/FR2444936A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149992A (en) * | 1976-06-09 | 1977-12-13 | Hitachi Ltd | Pressure transducer |
| JPS5365089A (en) * | 1976-11-24 | 1978-06-10 | Toshiba Corp | Semiconductor pressure transducer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008070241A (ja) * | 2006-09-14 | 2008-03-27 | Epson Toyocom Corp | 圧力センサ、及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2037988B (en) | 1983-03-02 |
| AU524762B2 (en) | 1982-09-30 |
| AU5379779A (en) | 1980-06-26 |
| GB2037988A (en) | 1980-07-16 |
| JPS5598323A (en) | 1980-07-26 |
| CA1126975A (en) | 1982-07-06 |
| IT1125925B (it) | 1986-05-14 |
| FR2444936B1 (it) | 1982-10-08 |
| DE2951469A1 (de) | 1980-07-03 |
| IT7928110A0 (it) | 1979-12-18 |
| FR2444936A1 (fr) | 1980-07-18 |
| SE7910311L (sv) | 1980-06-23 |
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