JPS6345015Y2 - - Google Patents
Info
- Publication number
- JPS6345015Y2 JPS6345015Y2 JP1981117282U JP11728281U JPS6345015Y2 JP S6345015 Y2 JPS6345015 Y2 JP S6345015Y2 JP 1981117282 U JP1981117282 U JP 1981117282U JP 11728281 U JP11728281 U JP 11728281U JP S6345015 Y2 JPS6345015 Y2 JP S6345015Y2
- Authority
- JP
- Japan
- Prior art keywords
- sides
- metal tube
- board
- circuits
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 1
- 229910003310 Ni-Al Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981117282U JPS5825056U (ja) | 1981-08-08 | 1981-08-08 | プリント回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981117282U JPS5825056U (ja) | 1981-08-08 | 1981-08-08 | プリント回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5825056U JPS5825056U (ja) | 1983-02-17 |
JPS6345015Y2 true JPS6345015Y2 (is) | 1988-11-22 |
Family
ID=29911466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981117282U Granted JPS5825056U (ja) | 1981-08-08 | 1981-08-08 | プリント回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5825056U (is) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6009901B2 (ja) * | 2012-10-19 | 2016-10-19 | 帝国通信工業株式会社 | リード線付き発光素子の回路基板への取付構造 |
JP6173816B2 (ja) * | 2013-07-23 | 2017-08-02 | Hoya株式会社 | 走査型共焦点内視鏡システム |
JP6982755B2 (ja) * | 2017-02-10 | 2021-12-17 | ダイヤゼブラ電機株式会社 | プリント回路基板及びプリント回路装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5110367A (en) * | 1974-04-04 | 1976-01-27 | Raychem Corp | Fukusukonobukito 1 konokibantooketsugosaseruhoho narabini sochi oyobi konekutakiban |
JPS5562796A (en) * | 1978-11-02 | 1980-05-12 | Matsushita Electric Ind Co Ltd | Method of mounting electronic part on printed board |
-
1981
- 1981-08-08 JP JP1981117282U patent/JPS5825056U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5110367A (en) * | 1974-04-04 | 1976-01-27 | Raychem Corp | Fukusukonobukito 1 konokibantooketsugosaseruhoho narabini sochi oyobi konekutakiban |
JPS5562796A (en) * | 1978-11-02 | 1980-05-12 | Matsushita Electric Ind Co Ltd | Method of mounting electronic part on printed board |
Also Published As
Publication number | Publication date |
---|---|
JPS5825056U (ja) | 1983-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5531860A (en) | Structure and method for providing a lead frame with enhanced solder wetting leads | |
WO1984002248A1 (en) | Method of connecting double-sided circuits | |
JPS6345015Y2 (is) | ||
US3451122A (en) | Methods of making soldered connections | |
JP2501174B2 (ja) | 表面実装用端子の製造方法 | |
JPS6236371B2 (is) | ||
JPH08279674A (ja) | 金属ベース回路基板と外部リード線との接続装置 | |
JP3275413B2 (ja) | リードフレームおよびその製造方法 | |
JP2784248B2 (ja) | 半導体装置の製造方法 | |
JPH0528752Y2 (is) | ||
JPH0218594B2 (is) | ||
JP3096816B2 (ja) | 電気的接続部材の製造方法 | |
JPH0217954B2 (is) | ||
JPS60121064A (ja) | 金属ベ−ス回路基板の端子半田付け方法 | |
JPH1064756A (ja) | 電子部品 | |
JPH0448124Y2 (is) | ||
JP2580607B2 (ja) | 回路基板及び回路基板の製造方法 | |
JPH04208510A (ja) | チップ型電子部品 | |
JPS5840617Y2 (ja) | 印刷配線板 | |
JPH1092998A (ja) | 電子デバイス製造用リードフレーム | |
JP2813998B2 (ja) | 電子部品搭載用基板 | |
JPH0456461B2 (is) | ||
JPS6259461B2 (is) | ||
JPH0794035A (ja) | 中継接続用テープ電線 | |
JPH0582591A (ja) | 半導体装置用フイルムキヤリア |