JPS6344315B2 - - Google Patents
Info
- Publication number
- JPS6344315B2 JPS6344315B2 JP54049503A JP4950379A JPS6344315B2 JP S6344315 B2 JPS6344315 B2 JP S6344315B2 JP 54049503 A JP54049503 A JP 54049503A JP 4950379 A JP4950379 A JP 4950379A JP S6344315 B2 JPS6344315 B2 JP S6344315B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- film
- film carrier
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4950379A JPS55141733A (en) | 1979-04-20 | 1979-04-20 | Method for coating film-carrier part installed on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4950379A JPS55141733A (en) | 1979-04-20 | 1979-04-20 | Method for coating film-carrier part installed on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55141733A JPS55141733A (en) | 1980-11-05 |
| JPS6344315B2 true JPS6344315B2 (enrdf_load_stackoverflow) | 1988-09-05 |
Family
ID=12832932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4950379A Granted JPS55141733A (en) | 1979-04-20 | 1979-04-20 | Method for coating film-carrier part installed on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55141733A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06101494B2 (ja) * | 1991-02-14 | 1994-12-12 | インターナショナル・ビジネス・マシーンズ・コーポレイション | テープ自動化ボンディング・デバイス用の保護下部コーティング |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51103264A (en) * | 1975-03-06 | 1976-09-11 | Omron Tateisi Electronics Co | Denshisochino seizohoho |
| JPS5399874A (en) * | 1977-02-14 | 1978-08-31 | Hitachi Ltd | Continuous semiconductor covering equipment |
-
1979
- 1979-04-20 JP JP4950379A patent/JPS55141733A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55141733A (en) | 1980-11-05 |
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