JPS55141733A - Method for coating film-carrier part installed on printed circuit board - Google Patents

Method for coating film-carrier part installed on printed circuit board

Info

Publication number
JPS55141733A
JPS55141733A JP4950379A JP4950379A JPS55141733A JP S55141733 A JPS55141733 A JP S55141733A JP 4950379 A JP4950379 A JP 4950379A JP 4950379 A JP4950379 A JP 4950379A JP S55141733 A JPS55141733 A JP S55141733A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
hole
coating film
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4950379A
Other languages
Japanese (ja)
Other versions
JPS6344315B2 (en
Inventor
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4950379A priority Critical patent/JPS55141733A/en
Publication of JPS55141733A publication Critical patent/JPS55141733A/en
Publication of JPS6344315B2 publication Critical patent/JPS6344315B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To prevent yield of cavities and to perform secure coating on chip parts by printing resinous paint so as to cover the chip parts on a film carrier. CONSTITUTION:A print mask 11 is provided with a hole 10, which has a step, on the side which is opposite with respect to the surface of a printed circuit board 1 on which parts are attached. The mask 11 is opposed to said printed circuit board 1. Resinous paint 12 which is placed on the mask surface is buried into the hole by one printing action of a squeezer 13 and painting is made. Then, the printed circuit board 1 is placed in heated atmosphere, and the resinous paint 12 is cured, thereby a resinous protection film for film carrier parts 3 is formed on the entire area of the hole.
JP4950379A 1979-04-20 1979-04-20 Method for coating film-carrier part installed on printed circuit board Granted JPS55141733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4950379A JPS55141733A (en) 1979-04-20 1979-04-20 Method for coating film-carrier part installed on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4950379A JPS55141733A (en) 1979-04-20 1979-04-20 Method for coating film-carrier part installed on printed circuit board

Publications (2)

Publication Number Publication Date
JPS55141733A true JPS55141733A (en) 1980-11-05
JPS6344315B2 JPS6344315B2 (en) 1988-09-05

Family

ID=12832932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4950379A Granted JPS55141733A (en) 1979-04-20 1979-04-20 Method for coating film-carrier part installed on printed circuit board

Country Status (1)

Country Link
JP (1) JPS55141733A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277640A (en) * 1991-02-14 1992-10-02 Internatl Business Mach Corp <Ibm> Protective lower-part coating for tape- automated bonding device use

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103264A (en) * 1975-03-06 1976-09-11 Omron Tateisi Electronics Co Denshisochino seizohoho
JPS5399874A (en) * 1977-02-14 1978-08-31 Hitachi Ltd Continuous semiconductor covering equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103264A (en) * 1975-03-06 1976-09-11 Omron Tateisi Electronics Co Denshisochino seizohoho
JPS5399874A (en) * 1977-02-14 1978-08-31 Hitachi Ltd Continuous semiconductor covering equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277640A (en) * 1991-02-14 1992-10-02 Internatl Business Mach Corp <Ibm> Protective lower-part coating for tape- automated bonding device use
JPH06101494B2 (en) * 1991-02-14 1994-12-12 インターナショナル・ビジネス・マシーンズ・コーポレイション Protective undercoat for tape automated bonding devices

Also Published As

Publication number Publication date
JPS6344315B2 (en) 1988-09-05

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