JPS6343891B2 - - Google Patents
Info
- Publication number
- JPS6343891B2 JPS6343891B2 JP57117210A JP11721082A JPS6343891B2 JP S6343891 B2 JPS6343891 B2 JP S6343891B2 JP 57117210 A JP57117210 A JP 57117210A JP 11721082 A JP11721082 A JP 11721082A JP S6343891 B2 JPS6343891 B2 JP S6343891B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- film
- metal film
- forming
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11721082A JPS598354A (ja) | 1982-07-06 | 1982-07-06 | 金属膜配線の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11721082A JPS598354A (ja) | 1982-07-06 | 1982-07-06 | 金属膜配線の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS598354A JPS598354A (ja) | 1984-01-17 |
JPS6343891B2 true JPS6343891B2 (ko) | 1988-09-01 |
Family
ID=14706111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11721082A Granted JPS598354A (ja) | 1982-07-06 | 1982-07-06 | 金属膜配線の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS598354A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62225341A (ja) * | 1986-03-27 | 1987-10-03 | 住友金属工業株式会社 | 接着用塗装鋼板 |
CN101950748B (zh) * | 2005-01-28 | 2013-06-12 | 株式会社半导体能源研究所 | 半导体器件和制造它的方法 |
JP2010016240A (ja) * | 2008-07-04 | 2010-01-21 | Panasonic Corp | インダクタとその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5025310A (ko) * | 1973-03-01 | 1975-03-18 |
-
1982
- 1982-07-06 JP JP11721082A patent/JPS598354A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5025310A (ko) * | 1973-03-01 | 1975-03-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS598354A (ja) | 1984-01-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58210634A (ja) | 半導体装置の製造方法 | |
JP2822430B2 (ja) | 層間絶縁膜の形成方法 | |
US5427982A (en) | Method for fabricating a semiconductor device | |
JPS6343891B2 (ko) | ||
JP2606315B2 (ja) | 半導体装置の製造方法 | |
JPH0346977B2 (ko) | ||
JPH0249017B2 (ko) | ||
JPS6193650A (ja) | 半導体装置の製造方法 | |
JPS59926A (ja) | アルミニウム膜の選択エツチング法 | |
JPS6254427A (ja) | 半導体装置の製造方法 | |
JP2597424B2 (ja) | 半導体装置の製造方法 | |
JPH0478013B2 (ko) | ||
JPS6218034A (ja) | 半導体装置の製造方法 | |
JPH0119255B2 (ko) | ||
JPH0481329B2 (ko) | ||
JPS5874037A (ja) | 半導体装置の製造方法 | |
JPS63275113A (ja) | 半導体装置の製造方法 | |
JPS59214228A (ja) | 半導体装置の製造方法 | |
JP2912002B2 (ja) | 半導体装置の製造方法 | |
JP3036038B2 (ja) | 半導体装置の製造方法 | |
JPS5843540A (ja) | 半導体装置の配線形成方法 | |
JPH0148652B2 (ko) | ||
JPS6116545A (ja) | 半導体集積回路装置の製造方法 | |
JPS61287146A (ja) | 多層配線の形成方法 | |
JPH0513376B2 (ko) |