JPS6342879B2 - - Google Patents

Info

Publication number
JPS6342879B2
JPS6342879B2 JP56128033A JP12803381A JPS6342879B2 JP S6342879 B2 JPS6342879 B2 JP S6342879B2 JP 56128033 A JP56128033 A JP 56128033A JP 12803381 A JP12803381 A JP 12803381A JP S6342879 B2 JPS6342879 B2 JP S6342879B2
Authority
JP
Japan
Prior art keywords
layer
conductor layer
plating
printed
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56128033A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5830194A (ja
Inventor
Fukuzo Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP12803381A priority Critical patent/JPS5830194A/ja
Publication of JPS5830194A publication Critical patent/JPS5830194A/ja
Publication of JPS6342879B2 publication Critical patent/JPS6342879B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12803381A 1981-08-14 1981-08-14 セラミック多層配線基板の製造法 Granted JPS5830194A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12803381A JPS5830194A (ja) 1981-08-14 1981-08-14 セラミック多層配線基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12803381A JPS5830194A (ja) 1981-08-14 1981-08-14 セラミック多層配線基板の製造法

Publications (2)

Publication Number Publication Date
JPS5830194A JPS5830194A (ja) 1983-02-22
JPS6342879B2 true JPS6342879B2 (en:Method) 1988-08-25

Family

ID=14974847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12803381A Granted JPS5830194A (ja) 1981-08-14 1981-08-14 セラミック多層配線基板の製造法

Country Status (1)

Country Link
JP (1) JPS5830194A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63191914A (ja) * 1987-02-05 1988-08-09 Fuji Koki Seisakusho:Kk 圧縮機駆動部の回転検出装置
JPH0259470U (en:Method) * 1988-10-24 1990-05-01

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171195A (ja) * 1983-03-18 1984-09-27 日本碍子株式会社 セラミツク多層配線基板の製造法
JPS6149493A (ja) * 1984-08-18 1986-03-11 富士通株式会社 多層配線基板
JPS63153893A (ja) * 1986-12-18 1988-06-27 伊勢電子工業株式会社 多層プリント配線板
JPH0693545B2 (ja) * 1988-12-23 1994-11-16 株式会社住友金属セラミックス セラミック多層配線基板およびその製造方法
JPH04146888A (ja) * 1990-10-05 1992-05-20 Shinkurushima Dock:Kk コンテナ艙兼用の貨物冷蔵艙
JPH04146889A (ja) * 1990-10-08 1992-05-20 Shinkurushima Dock:Kk コンテナ艙兼用の貨物冷蔵艙
JP2798566B2 (ja) * 1992-10-07 1998-09-17 京セラ株式会社 回路基板の製造方法
TW200943330A (en) * 2008-03-06 2009-10-16 Ceramtec Ag Metallized coil bodies (inductor) having high q-value

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954859A (en:Method) * 1972-09-27 1974-05-28
JPS51133766A (en) * 1975-05-14 1976-11-19 Ngk Spark Plug Co Method of forming thick film circuit components on ceramic substrate
JPS5371269A (en) * 1976-12-07 1978-06-24 Fujitsu Ltd Method of producing multilayer circuit board
JPS5712775U (en:Method) * 1980-06-25 1982-01-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63191914A (ja) * 1987-02-05 1988-08-09 Fuji Koki Seisakusho:Kk 圧縮機駆動部の回転検出装置
JPH0259470U (en:Method) * 1988-10-24 1990-05-01

Also Published As

Publication number Publication date
JPS5830194A (ja) 1983-02-22

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