JPS6342407B2 - - Google Patents

Info

Publication number
JPS6342407B2
JPS6342407B2 JP53042131A JP4213178A JPS6342407B2 JP S6342407 B2 JPS6342407 B2 JP S6342407B2 JP 53042131 A JP53042131 A JP 53042131A JP 4213178 A JP4213178 A JP 4213178A JP S6342407 B2 JPS6342407 B2 JP S6342407B2
Authority
JP
Japan
Prior art keywords
electrode
protruding electrode
opening
metal film
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53042131A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54134975A (en
Inventor
Mikio Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4213178A priority Critical patent/JPS54134975A/ja
Publication of JPS54134975A publication Critical patent/JPS54134975A/ja
Publication of JPS6342407B2 publication Critical patent/JPS6342407B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP4213178A 1978-04-12 1978-04-12 Connection method of semiconductor device Granted JPS54134975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4213178A JPS54134975A (en) 1978-04-12 1978-04-12 Connection method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4213178A JPS54134975A (en) 1978-04-12 1978-04-12 Connection method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS54134975A JPS54134975A (en) 1979-10-19
JPS6342407B2 true JPS6342407B2 (en, 2012) 1988-08-23

Family

ID=12627371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4213178A Granted JPS54134975A (en) 1978-04-12 1978-04-12 Connection method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54134975A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04155835A (ja) * 1990-10-18 1992-05-28 Mitsubishi Electric Corp 集積回路装置の製造方法

Also Published As

Publication number Publication date
JPS54134975A (en) 1979-10-19

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