JPS6341056A - Production apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To cut connecting sections on both sides of a lead frame positively, and to improve productivity by disposing a stripper holding the outer frame of the lead frame, a punch capable of holding one part of the lead frame on the inside of a die and a knock-out die in an ascendable and descendable manner. CONSTITUTION:The outer frame 4 of a lead frame 3 is placed on a die 2. The lower section of a package 8 is housed in the indentation section 22a of a knock-out die 22 at that time. When a punch 21 and a stripper 1 are lowered and the outer frame 4 of the lead frame 3 is held while leads 9 are put, approximately the whole of the package 8 is received in the indentation section 21a of the punch 21 and the indentation section 22a of the knock-out die 22. The punch 21 and the knock-out die 22 are brought down, and connecting sections 6, 7 on both sides of the lead frame 3 are cut. Accordingly, a semiconductor device can be detached positively from the lead frame 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing apparatus for separating a semiconductor device from a G-1 frame.

[Conventional technology]

Conventionally, this type of semiconductor manufacturing apparatus has been constructed as shown in FIG. This can be roughly explained based on the same figure.
In the same figure, 1 and 2 are a stripper and a die that hold the outer frame 4 of the lead frame 3 shown in FIG. This is a punch for cutting the connecting portions 6 and 7 of. Note that 8 is a puff cage for resin-sealing a semiconductor element (not shown) on a die pad (not shown);
is a lead connected to a semiconductor element (not shown) in this package 8 by a wire (not shown).

Furthermore, as shown in FIG. 5, some conventional semiconductor manufacturing equipment includes a punch 10 that has a recess (not shown) in which a package 8 can be housed and moves up and down inside the stripper 1 and the die 2. .

In the semiconductor manufacturing equipment configured in this way, the third
As shown in the drawings and FIG. 5, by lowering the punch 5.degree. 10, the connecting portions 6.7 on both sides of the lead frame 3 are pressed and cut, and the semiconductor device 11 shown in FIG. 6 is separated from the lead frame 3.

[Problem that the invention seeks to solve]

By the way, in conventional semiconductor manufacturing equipment, the punch 5
, 10 act on the connecting portions 6 and 7 on both sides of the lead frame 3 at approximately the same time, so that if one connecting portion 6 is cut first, the connecting portion 7 on the other side will be cut. Sometimes it would just bend downwards and not be cut. As a result, there was a problem in that the molding process in the next step was adversely affected and productivity was reduced.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor manufacturing apparatus that can reliably cut the connecting portions on both sides of a lead frame, thereby improving productivity.

[Means for solving problems]

A semiconductor manufacturing apparatus according to the present invention includes a stripper that holds an outer frame of a lead frame, and a punch and a knockout die capable of holding a part of a lead frame, which are movably disposed inside a die and a stripper.

[For production]

In the present invention, when a semiconductor device is separated from a lead frame, a cutting force is applied to the connecting portions on both sides of the lead frame while a portion of the lead frame is being held.

〔Example〕

FIGS. 1(a), (b) and 2 are a cross-sectional view and a perspective view showing a semiconductor manufacturing apparatus according to the present invention, and in these figures, the same members as in FIGS. 3 to 6 have the same reference numerals. , and detailed explanation will be omitted. In the figure, reference numerals 21 and 22 indicate a block-shaped punch and a knockout die capable of holding a part of the lead frame 3, that is, the lead 9, and are arranged inside the stripper 1 and the die 2 so as to be able to rise and fall freely. Each side facing each other has a recessed portion 21a in which the upper and lower portions of the package 8 can be accommodated.

22a is formed.

In the semiconductor manufacturing apparatus configured in this manner, when the semiconductor device 11 is separated from the lead frame 3, a cutting force is applied to the connecting portions 6 and 7 on both sides of the lead frame 3 while the leads 9 of the lead frame 3 are being held. It turns out.

Therefore, even if the connecting portion 6 on one side of the connecting portions 6,7 on both sides of the lead frame 3 is cut first due to the lowering of the punch 21 and the knockout die 22, the connecting portion 7 on the other side can also be cut. .

Next, a method for separating the semiconductor device 11 from the lead frame 3 using the semiconductor manufacturing apparatus of this embodiment will be described.

First, the outer frame 4 of the lead frame 3 is placed on the die 2. At this time, the lower part of the package 8 is housed in the recessed part 22a of the knockout die 22. Next, punch 2
1 and the stripper 1 are lowered to hold the outer frame 4 of the lead frame 3 and to clamp the leads 9. At this time, the package 8 is substantially entirely covered by the concave portion 21 of the punch 21.
a and is accommodated in the recessed portion 22a of the knockout die 22. Then, the punch 21 and the knockout die 22 are lowered and the connecting portions 6.7 on both sides of the lead frame 3 are removed.
cut.

In this manner, the semiconductor device 11 can be reliably separated from the lead frame 3.

In this embodiment, when separating the semiconductor device 11 from the lead frame 3, the stripper 1 and the die 2 are stopped and the punch 21 and the knockout die 22 are removed.
Although the case where the punch 21 and the knockout die 2 are operated is shown, the present invention is not limited to this.
Even if the stripper 1 and the die 2 are operated while the stripper 2 is stopped, the same effects as in the embodiment can be obtained.

Further, the shapes of the punch 21 and the knockout die 22 in the present invention are not limited to the embodiments described above, and may be rod-shaped, for example, and the shapes can be modified as appropriate.

[Effects of the Invention] As explained above, according to the present invention, a punch and a knockout die capable of holding a part of the lead frame are disposed inside the stripper and die that hold the outer frame of the lead frame so as to be able to move up and down. Therefore, when separating the semiconductor device from the lead frame, a cutting force is applied to the connecting portions on both sides of the lead frame while a portion of the lead frame is being held. Therefore, even if the connecting portion on one side of the connecting portions on both sides of the lead frame is cut first due to the lowering of the punch and knockout die, the connecting portion on the other side can also be cut, so that the next process can be performed as in the conventional method. There will be no negative impact on the product, and productivity can be reliably improved.

[Brief explanation of the drawing]

Figures 1 (al, (bl) and Figure 2 are a cross-sectional view and a perspective view of a semiconductor manufacturing apparatus according to the present invention, Figure 3 is a cross-sectional view of a conventional semiconductor manufacturing apparatus, and Figure 4 is a semiconductor element made of resin. FIG. 5 is a perspective view showing a sealed lead frame, FIG. 5 is a sectional view showing a conventional semiconductor manufacturing apparatus, and FIG. 6 is a plan view showing a semiconductor device. 1...Strimper, 2... Die , 3...Lead frame, 4...Outer frame, 6.7...Connection part, 21...Punch, 22...Knockout die. Agent: Yudai Masu Oiwa Figure 1 (0) (b) 1: Stoso, Ba 6, 7; Tatsukichi 1-P4.7 To A1〒 Figure 2 Figure 3 Figure 4 Figure 5 Q Figure 6

Claims (1)

[Claims] In a semiconductor manufacturing device that cuts the connections on both sides of a lead frame in which a semiconductor element on a die pad is resin-sealed, a part of the lead frame can be held between a stripper that holds the outer frame of the lead frame and the inside of the die. A semiconductor manufacturing device characterized in that a punch and a knockout die are arranged so as to be movable up and down.