JP2531088B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and its
A manufacturing method, particularly a resin-sealed semiconductor device and the same
It relates to a manufacturing method .

[0002]

2. Description of the Related Art FIG. 5A shows an SOP (Small Outlin).
It is a top view of the conventional lead frame used for manufacturing an e Package) type semiconductor device. As shown in the figure, in the lead frame 1, the island 2 is supported by the frame portions 7 a and 7 b via the suspension leads 3,
The internal leads 4 connected to the pads on the semiconductor element via bonding wires are tie bars 5 connected between the frame parts 7a and 7b, and the external leads 6 led out of the package are the frame parts 7a. , 7b, and is supported by a tie bar 5 and a section bar 8.

FIG. 6A shows a QFP (Quad Flat Pack).
FIG. 6 is a partial plan view of a conventional lead frame used for manufacturing an age) type semiconductor device. In the lead frame for this purpose, the island 2 is almost square,
The four corners are supported by suspension leads 3, and the suspension leads 3 are supported by a frame portion (not shown). The inner leads 4 arranged so as to surround the island 2 are supported by tie bars 5. The external lead 6 extending vertically from the tie bar 5 is supported at its other end by a frame portion (not shown), and the external lead 6 extending laterally connects the other end between frame portions extending vertically in the drawing. It is supported by section bars (neither shown).

A semiconductor element is mounted on the island 2 of the lead frame shown in FIGS. 5A and 6A with silver paste or the like, and the pads on the semiconductor element and the tips of the internal leads 3 are mounted. And are connected by a bonding wire. Subsequently, the semiconductor element is resin-sealed by the transfer molding method [(a) of FIG. 5 and the resin sealing line 14 is shown by a dashed line in FIG. 6, the tie bar 5 and the suspension leads 3 are cut to complete the manufacture of the semiconductor device.

FIG. 5B is a side view of a semiconductor device manufactured using the lead frame shown in FIG. 5A, and FIG. 6B is shown in FIG. 5A. FIG. 16 is a perspective view of a main portion of a semiconductor device manufactured using the lead frame shown.
In the conventional lead frame, the suspension leads 3 supporting the islands 2 are led out to the outside of the resin sealing line 14, so that the suspension lead cutting portion 3a has the molded resin package 1.
The side of 2 is exposed. Further, in the semiconductor device in which the external leads 6 are led out from the four sides of the package like the QFP type package, as shown in FIG. 6B, the suspension leads 3 are usually led out from the corners of the package 12, Moreover, there was the resin injection port 12a at the time of resin sealing.

Depending on the semiconductor device, it may be required to apply the potential of the island 2 from the external lead 6. In such a case, in the conventional lead frame, the suspension lead 3 was connected to the internal lead 4. However, also in this case, the suspension lead was led out of the resin sealing line 14 so as to be supported by the frame portion. The suspension lead cutting portion 3a appeared on the side surface of the package.

[0007]

In the semiconductor device using the above-mentioned conventional lead frame, it was necessary to cut the suspension lead at the end face of the package after resin sealing.
Since this cutting is cutting of cantilevered leads, the cutting is performed in a process close to "tear-off".
Defects such as cutting residue and "sag" tended to occur. In particular, in a semiconductor device having a thin sealing resin such as TSOP (Thin Small Outline Package), there is a high possibility that a "chip" defect may occur at the end of the sealing resin due to the processing pressure applied when cutting the suspension lead.

Further, in the case where the external leads are led out from each side of the package like the QFP type semiconductor device, the suspension leads are usually led out from the corners of the package,
And that portion is used as a resin injection port at the time of resin sealing. Therefore, there is a problem that the suspension lead interferes with the resin injection, or the suspension lead interferes with the resin removing work of the resin injection port after the resin is sealed. Therefore, an object of the present invention is to prevent the suspension leads from being led out of the resin mold package, and therefore to solve the above-mentioned inconveniences at once.

[0009]

[Means for Solving the Problems] To achieve the above object
In the semiconductor device according to the present invention , the semiconductor element is mounted on the island (2) connected to the suspension lead (3),
The semiconductor element and the internal lead (4) are connected by a bonding wire, and the semiconductor element is molded resin (12).
And the recessed hole (1
3) is formed, and the connection between the suspension lead (3) and the internal lead (4) is cut at the recessed hole.

[0010]

In the method of manufacturing a semiconductor device according to the present invention, the semiconductor element is mounted on the island of the lead frame in which the suspension lead (3) supporting the island (2) is supported only by the internal lead (4). The process and the lead frame (1) in the molding die (9, 10) having the protrusions (9a, 10a) sandwiching the connecting portion between the suspension lead (3) and the inner lead (4) of the lead frame ) Is placed to seal the semiconductor element with resin, and a step of cutting the connecting portion between the suspension lead (3) and the internal lead (4) of the lead frame is provided.

[0012]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a first embodiment of the present invention, S
It is a principal part enlarged plan view of the lead frame for OP type semiconductor devices. As shown in the figure, the suspension lead 3 supporting the island 2 is connected to the inner lead 4 and is supported only by the inner lead 4. That is, in the lead frame according to the present invention, the suspension lead 3 is connected to the frame portion 7.
The resin sealing line 14 is not directly supported by a.
Will not be derived outside.

The internal leads 4 arranged so as to surround the island 2 have a pair of frame portions 7a extending vertically in the drawing.
It is supported by tie bars 5 that are bridged between (the upper frame portion is not shown). The external leads 6 extending from the tie bar 5 to the left and right are supported by the tie bar 5 and a section bar (not shown) extending in the up-down direction on the left and right in the drawing.

Next, a method of manufacturing a semiconductor device using the lead frame of this embodiment will be described. The semiconductor element is mounted on the island 2 of the lead frame 1 via silver paste or the like, and the pad on the semiconductor element and the internal lead 3
Is connected to the tip end of by a bonding wire. Subsequently, as shown in FIG. 2, the lead frame 1 on which the semiconductor element is mounted is carried in between the lower mold 9 and the upper mold 10 of the transfer molding apparatus, and after positioning, mold clamping is performed.
The lower mold 9 and the upper mold 10 have a truncated cone-shaped projection 9a that projects into a cavity 11 formed by both molds.
10a are formed and these protrusions 9a, 10a are formed.
When the mold is clamped, the connecting portion (indicated by A in the figure) between the suspension lead 3 and the internal lead 4 of the lead frame 1 is sandwiched from the upper and lower surfaces.

In this state, resin is injected to seal the resin. The resin-sealed lead frame is carried out from the transfer molding device, and the lead frame is attached to the tie bar 5,
The tip of the external lead is cut into individual semiconductor devices. At this time, at the same time, the connecting portion A between the suspension lead 3 and the inner lead 4 is punched out. However, in the semiconductor device in which it is necessary to apply a potential to the island 2 by the external lead 6, the connecting portion A is not punched.

FIG. 3A is a plan view of the semiconductor device thus formed, and FIG. 3B is a side view thereof. As shown in the figure, the resin mold package 12 is provided with recessed holes 13 corresponding to the protrusions 9a and 10a of the molding die. The recessed hole portion is used as a path of the tool when punching out the connecting portion A between the suspension lead 3 and the inner lead 4.

In the above manufacturing process, it is easy to punch the connecting portion A by punching.
It is difficult for the ends of the suspension leads to have uncut parts, “sagging”, etc., or for the resin to have “chip” defects. Further, even if the above-mentioned inconvenience occurs in the suspension lead, it is not necessary to treat it as a defective appearance, so that the yield can be substantially improved.

FIG. 4 shows a second embodiment of the present invention, Q
It is a principal part enlarged plan view of the lead frame for FP type semiconductor devices. In the figure, portions corresponding to the portions of the conventional lead frame shown in FIG. 6A are designated by the same reference numerals, and a duplicate description will be omitted. As shown in FIG. 4, also in the lead frame for the QFP package, the suspension lead 3 is supported by the internal lead 4 and is not led out to the outside of the resin sealing line 14.

A semiconductor device using the lead frame of this embodiment can be assembled in the same manner as in the previous embodiment. That is, at the time of resin sealing, the suspension leads 3 of the lead frame 1
Resin molding is performed using upper and lower molding dies having a protrusion that presses down the connecting portion A between the inner lead 4 and the inner lead 4, and thereafter, the semiconductor device is cut and separated from the lead frame (potential from the outer lead to the island. The connecting portion A of the lead frame is removed by punching (excluding the case where the above is given).

In this embodiment, the following effects can be expected in addition to the effects of the previous embodiment. That is, in the manufacturing method of the present embodiment, the sealing resin is injected from the corners of the package, but since the suspension lead does not exist here, the suspension lead does not interfere with the injected resin and the suspension lead does not exist. The area of the inlet is widened by the cross-section integration of
Good resin sealing property can be obtained. Further, after the resin is sealed, the resin at the unnecessary resin injection port can be easily removed because the suspension leads are not obstructed.

In each of the above-described embodiments, the recessed hole portion 13 provided in the molded resin package 12 is filled with resin or the like after (or without cutting) the connection portion A between the suspension lead 3 and the internal lead 4. can do. By doing so, it is possible to obtain a semiconductor device having an appearance similar to the conventional one. Further, the present invention can be applied not only to the lead frame for the flat type package but also to the lead frame for the DIP type package.

[0022]

As described above, the semiconductor according to the present invention is
The body device is such that the resin-molded package is provided with a recessed hole portion that exposes the connection portion between the suspension lead and the internal lead, and the connection portion of the suspension lead can be cut by the recessed hole portion. According to this, it becomes possible to easily cut the suspension leads, and there is no defect such as uncut residue of the suspension leads at the end face of the package, "drooping", or "chip" of resin, which has been conventionally caused when the suspension leads are cut. Occurrence can be suppressed. Further, even if the suspension lead suffers from the above-mentioned "drooping", it is not necessary to treat it as a defective appearance, and the yield can be substantially improved.

Further, in the semiconductor device in which the external leads are led out from the four sides of the package, since the suspending leads do not exist in the resin injection port which is the corner of the package, the suspending leads do not hinder the injected resin, and The area of the injection port is increased by the integral of the cross section of the suspension lead, and good resin sealing property can be obtained. Further, it becomes possible to easily remove the resin in the unnecessary resin injection port portion after the resin sealing without being hindered by the suspension lead.

[Brief description of drawings]

FIG. 1 is a partial plan view showing a lead frame according to a first embodiment of the present invention.

FIG. 2 is a sectional view for explaining the method for manufacturing the semiconductor device using the lead frame of the first embodiment of the present invention.

FIG. 3 is a partial plan view and a side view of the semiconductor device according to the first embodiment of the present invention.

FIG. 4 is a partial plan view showing a lead frame according to a second embodiment of the present invention.

FIG. 5 is a plan view of a lead frame of a first conventional example and a side view of a semiconductor device using this lead frame.

FIG. 6 is a plan view of a lead frame of a second conventional example and a partial perspective view of a semiconductor device using this lead frame.

[Explanation of symbols]

 1 Lead Frame 2 Island 3 Suspended Lead 4 Inner Lead 5 Tie Bar 6 External Lead 7a, 7b Frame Part 8 Section Bar 9 Lower Mold 10 Upper Mold 11 Cavity 12 Resin Mold Package 13 Recessed Hole 14 Resin Sealing Line

Claims (7)

(57) [Claims] 1. A semiconductor device in which a semiconductor element is mounted on an island connected to a suspension lead, the semiconductor element and an internal lead are connected by a bonding wire, and the semiconductor element is sealed by a mold resin,
The semiconductor device is characterized in that the suspension lead is connected to the internal lead, and the connecting portion is exposed in a recessed hole portion formed in the mold resin. 2. A semiconductor device according to claim 1, characterized in that the recessed hole portion is filled with a resin. 3. A semiconductor device in which a semiconductor element is mounted on an island connected to a suspension lead, the semiconductor element and an internal lead are connected by a bonding wire, and the semiconductor element is sealed with a mold resin,
A semiconductor device, wherein a recessed hole portion is formed in the mold resin, and a connection portion between the suspension lead and the internal lead is cut in the recessed hole portion. 4. The semiconductor device according to claim 3, wherein the recessed hole is filled with resin. 5. A step of mounting a semiconductor element on an island of a lead frame in which a suspension lead supporting an island is supported only by an internal lead, and a connecting portion between the suspension lead of the lead frame and the internal lead is formed from both upper and lower surfaces. And a step of placing a lead frame in a molding die having a sandwiched protrusion and resin-sealing the semiconductor element. 6. A step of mounting a semiconductor element on an island of a lead frame in which a suspension lead supporting an island is supported only by an internal lead, and a connecting portion between the suspension lead of the lead frame and the internal lead is formed from both upper and lower surfaces. A semiconductor device comprising: a step of disposing a lead frame in a molding die having a sandwiched protrusion and resin-sealing a semiconductor element; and a step of cutting a connecting portion between a suspension lead and an internal lead of the lead frame. Production method. 7. A step of mounting a semiconductor element on an island of a lead frame in which a suspension lead supporting an island is supported only by an internal lead, and a connecting portion between the suspension lead of the lead frame and the internal lead is formed from both upper and lower surfaces. A step of arranging a lead frame in a molding die having a sandwiched projection and resin-sealing a semiconductor element; and a step of filling a recessed hole portion of the molding resin formed by the projection of the molding die with a resin. A method for manufacturing a semiconductor device, comprising: