JPS6340329A - アウタ−リ−ドボンディング装置 - Google Patents

アウタ−リ−ドボンディング装置

Info

Publication number
JPS6340329A
JPS6340329A JP61182821A JP18282186A JPS6340329A JP S6340329 A JPS6340329 A JP S6340329A JP 61182821 A JP61182821 A JP 61182821A JP 18282186 A JP18282186 A JP 18282186A JP S6340329 A JPS6340329 A JP S6340329A
Authority
JP
Japan
Prior art keywords
semiconductor device
outer lead
cutting
positional deviation
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61182821A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453097B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Minoru Okamura
岡村　實
Fumimaro Ikeda
池田　史麻呂
Hideaki Miyoshi
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Marine Instr Co Ltd
Original Assignee
NEC Corp
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP61182821A priority Critical patent/JPS6340329A/ja
Publication of JPS6340329A publication Critical patent/JPS6340329A/ja
Publication of JPH0453097B2 publication Critical patent/JPH0453097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61182821A 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置 Granted JPS6340329A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61182821A JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61182821A JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Publications (2)

Publication Number Publication Date
JPS6340329A true JPS6340329A (ja) 1988-02-20
JPH0453097B2 JPH0453097B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-08-25

Family

ID=16125045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61182821A Granted JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Country Status (1)

Country Link
JP (1) JPS6340329A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273397A (ja) * 1988-04-26 1989-11-01 Marine Instr Co Ltd アウターリードボンディング装置における半導体チップ移送装置
JPH01273396A (ja) * 1988-04-26 1989-11-01 Marine Instr Co Ltd アウターリードボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273397A (ja) * 1988-04-26 1989-11-01 Marine Instr Co Ltd アウターリードボンディング装置における半導体チップ移送装置
JPH01273396A (ja) * 1988-04-26 1989-11-01 Marine Instr Co Ltd アウターリードボンディング装置

Also Published As

Publication number Publication date
JPH0453097B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-08-25

Similar Documents

Publication Publication Date Title
EP1964162B1 (en) Rotary chip attach
JP6673794B2 (ja) 熱圧着ボンディング装置
US4887758A (en) Apparatus for connecting external leads
KR20000036092A (ko) 아이씨칩의 조립방법, 조립장치 및 그에 사용하는 테이프형지지체
JP2008100482A (ja) Ｔｃｐ実装装置におけるキャリアテープの接続方法、それを用いるｔｃｐ実装装置及び表示装置の製造方法
JPS6340329A (ja) アウタ−リ−ドボンディング装置
CN117059519B (zh) 一种多功能芯片组装一体机
JPH0226379B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP5325669B2 (ja) Ａｃｆ貼着装置
JPH0465845A (ja) アウターリードボンディング方法
JP2001308149A (ja) Ｆｐｃ用半導体実装装置及び方法
JPS6340328A (ja) アウタ−リ−ドボンデイング装置
JPS61166095A (ja) アウターリードボンディング装置
JPS61154196A (ja) アウタ−リ−ドボンデイング装置
JPH0418699B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3175737B2 (ja) 電子部品実装装置および電子部品実装方法
JPS6220339A (ja) テ−プボンデイング装置
JPH0131694B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2806222B2 (ja) リードフレームのテープ打抜貼着装置
JPH07142535A (ja) チップの実装装置および実装方法
JP2841761B2 (ja) フイルムキヤリアテープの打抜方法
JP2832744B2 (ja) インナーリードボンディング方法
JPH0878479A (ja) アウタリ−ドボンディング装置およびアウタリ−ドボンディング方法
JP3233137B2 (ja) 電子部品実装装置および電子部品実装方法
JP2853286B2 (ja) フィルムキャリアテープの処理装置