JPS6340328A - アウタ−リ−ドボンデイング装置 - Google Patents

アウタ−リ−ドボンデイング装置

Info

Publication number
JPS6340328A
JPS6340328A JP61182820A JP18282086A JPS6340328A JP S6340328 A JPS6340328 A JP S6340328A JP 61182820 A JP61182820 A JP 61182820A JP 18282086 A JP18282086 A JP 18282086A JP S6340328 A JPS6340328 A JP S6340328A
Authority
JP
Japan
Prior art keywords
bonding
semiconductor device
outer lead
printed circuit
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61182820A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0535572B2 (enExample
Inventor
Minoru Okamura
岡村　實
Fumimaro Ikeda
池田　史麻呂
Hideaki Miyoshi
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Marine Instr Co Ltd
Original Assignee
NEC Corp
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP61182820A priority Critical patent/JPS6340328A/ja
Publication of JPS6340328A publication Critical patent/JPS6340328A/ja
Publication of JPH0535572B2 publication Critical patent/JPH0535572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP61182820A 1986-08-05 1986-08-05 アウタ−リ−ドボンデイング装置 Granted JPS6340328A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61182820A JPS6340328A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61182820A JPS6340328A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6340328A true JPS6340328A (ja) 1988-02-20
JPH0535572B2 JPH0535572B2 (enExample) 1993-05-26

Family

ID=16125028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61182820A Granted JPS6340328A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6340328A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474228A (en) * 1993-08-28 1995-12-12 Kabushiki Kaisha Shinkawa External lead bonding method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474228A (en) * 1993-08-28 1995-12-12 Kabushiki Kaisha Shinkawa External lead bonding method and apparatus

Also Published As

Publication number Publication date
JPH0535572B2 (enExample) 1993-05-26

Similar Documents

Publication Publication Date Title
CN100481315C (zh) 传送电子元件的定位设备和方法
JP4372605B2 (ja) 電子部品搭載装置および電子部品搭載方法
KR20190042419A (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
JPH11150132A (ja) ダイボンダ
JPS6340328A (ja) アウタ−リ−ドボンデイング装置
JP2008100482A (ja) Ｔｃｐ実装装置におけるキャリアテープの接続方法、それを用いるｔｃｐ実装装置及び表示装置の製造方法
JP4949114B2 (ja) 接続材料塗布装置および半導体装置の製造方法
JP4119598B2 (ja) 電子部品実装装置および電子部品実装方法
JPH0226379B2 (enExample)
JP2001308149A (ja) Ｆｐｃ用半導体実装装置及び方法
JPH0453097B2 (enExample)
JP2746989B2 (ja) チップの位置決め方法およびその装置、インナリードボンディング装置およびインナリードボンディング方法
KR100833933B1 (ko) 반도체 패키지용 프레임에 방열판을 부착하는 장치 및 방법
JP2001284405A (ja) 半導体製造装置
JPS61154196A (ja) アウタ−リ−ドボンデイング装置
JP3440801B2 (ja) 電子部品の接合装置
JP2881743B2 (ja) 電子部品の実装装置及び電子部品の実装方法、認識装置及び認識方法
JP2001284407A (ja) 半導体製造装置
JPH0131694B2 (enExample)
JPS6386551A (ja) バンプ形成方法
JPH06310569A (ja) 半導体素子のフェースダウンボンディング法
JPS61166095A (ja) アウターリードボンディング装置
JPH0878479A (ja) アウタリ−ドボンディング装置およびアウタリ−ドボンディング方法
JP2001274179A (ja) チップマウンタおよび半導体装置の製造方法
JP3233137B2 (ja) 電子部品実装装置および電子部品実装方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees