JPH0226379B2 - - Google Patents

Info

Publication number
JPH0226379B2
JPH0226379B2 JP60004122A JP412285A JPH0226379B2 JP H0226379 B2 JPH0226379 B2 JP H0226379B2 JP 60004122 A JP60004122 A JP 60004122A JP 412285 A JP412285 A JP 412285A JP H0226379 B2 JPH0226379 B2 JP H0226379B2
Authority
JP
Japan
Prior art keywords
semiconductor
positional deviation
printed circuit
outer lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60004122A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61163649A (ja
Inventor
Minoru Okamura
Fumimaro Ikeda
Hideaki Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Nippon Electric Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP60004122A priority Critical patent/JPS61163649A/ja
Publication of JPS61163649A publication Critical patent/JPS61163649A/ja
Publication of JPH0226379B2 publication Critical patent/JPH0226379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP60004122A 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置 Granted JPS61163649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60004122A JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60004122A JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61163649A JPS61163649A (ja) 1986-07-24
JPH0226379B2 true JPH0226379B2 (enExample) 1990-06-08

Family

ID=11575980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60004122A Granted JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61163649A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633631B2 (ja) * 1988-07-12 1997-07-23 株式会社東芝 電子部品の実装装置
JPH0267739A (ja) * 1988-09-01 1990-03-07 Mitsubishi Electric Corp ダイボンディング方法とその装置
US5303824A (en) * 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use

Also Published As

Publication number Publication date
JPS61163649A (ja) 1986-07-24

Similar Documents

Publication Publication Date Title
US5894657A (en) Mounting apparatus for electronic component
JPWO2002071470A1 (ja) チップ実装方法およびその装置
JP2000150970A (ja) 発光素子のボンディング方法および装置
JPH0226379B2 (enExample)
JP3899867B2 (ja) 電子部品実装装置および電子部品実装方法
CN112331582A (zh) 芯片贴装装置以及半导体器件的制造方法
JPH0453097B2 (enExample)
JPH0466118B2 (enExample)
JP5157364B2 (ja) 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置
JP6942829B2 (ja) 電子部品の実装装置
JPH0453117B2 (enExample)
JPH0535572B2 (enExample)
KR100651789B1 (ko) 부품 실장장치 및, 부품 실장방법
JP3440801B2 (ja) 電子部品の接合装置
JPS6220339A (ja) テ−プボンデイング装置
JP7595264B2 (ja) 部品圧着装置および部品圧着方法
JPH0131694B2 (enExample)
JP4402810B2 (ja) 電子部品搭載機
JP2825300B2 (ja) キャリアテープ部品の実装装置
JP2832744B2 (ja) インナーリードボンディング方法
JPH05226412A (ja) アウタリードボンディング方法およびその装置
JPH0418699B2 (enExample)
JPH0878479A (ja) アウタリ−ドボンディング装置およびアウタリ−ドボンディング方法
JP3233137B2 (ja) 電子部品実装装置および電子部品実装方法
JP2000082724A (ja) 電子部品実装装置および電子部品実装方法