JPS6338878B2 - - Google Patents
Info
- Publication number
- JPS6338878B2 JPS6338878B2 JP57159233A JP15923382A JPS6338878B2 JP S6338878 B2 JPS6338878 B2 JP S6338878B2 JP 57159233 A JP57159233 A JP 57159233A JP 15923382 A JP15923382 A JP 15923382A JP S6338878 B2 JPS6338878 B2 JP S6338878B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- multilayer
- hole
- holes
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 230000004913 activation Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 58
- 239000011889 copper foil Substances 0.000 description 9
- 238000005553 drilling Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15923382A JPS5948996A (ja) | 1982-09-13 | 1982-09-13 | 多層プリント配線板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15923382A JPS5948996A (ja) | 1982-09-13 | 1982-09-13 | 多層プリント配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948996A JPS5948996A (ja) | 1984-03-21 |
| JPS6338878B2 true JPS6338878B2 (zh) | 1988-08-02 |
Family
ID=15689246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15923382A Granted JPS5948996A (ja) | 1982-09-13 | 1982-09-13 | 多層プリント配線板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948996A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546296Y2 (zh) * | 1988-02-02 | 1993-12-03 | ||
| US5001605A (en) * | 1988-11-30 | 1991-03-19 | Hughes Aircraft Company | Multilayer printed wiring board with single layer vias |
| JPH0340493A (ja) * | 1989-07-07 | 1991-02-21 | Matsushita Electric Works Ltd | 多層プリント配線板 |
| JPH0682929B2 (ja) * | 1992-03-30 | 1994-10-19 | イビデン株式会社 | 表面実装部品搭載用の多層プリント配線板 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49114067A (zh) * | 1973-03-07 | 1974-10-31 | ||
| JPS5013469A (zh) * | 1973-06-08 | 1975-02-12 | ||
| JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS5578598A (en) * | 1978-12-08 | 1980-06-13 | Fujitsu Ltd | Method of fabricating printed board |
| JPS5681999A (en) * | 1979-12-07 | 1981-07-04 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5792895A (en) * | 1980-12-02 | 1982-06-09 | Nippon Telegraph & Telephone | Method of laminating printed board |
| JPS57139996A (en) * | 1981-02-24 | 1982-08-30 | Nippon Electric Co | Hybrid multilayer circuit board |
-
1982
- 1982-09-13 JP JP15923382A patent/JPS5948996A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49114067A (zh) * | 1973-03-07 | 1974-10-31 | ||
| JPS5013469A (zh) * | 1973-06-08 | 1975-02-12 | ||
| JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS5578598A (en) * | 1978-12-08 | 1980-06-13 | Fujitsu Ltd | Method of fabricating printed board |
| JPS5681999A (en) * | 1979-12-07 | 1981-07-04 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5792895A (en) * | 1980-12-02 | 1982-06-09 | Nippon Telegraph & Telephone | Method of laminating printed board |
| JPS57139996A (en) * | 1981-02-24 | 1982-08-30 | Nippon Electric Co | Hybrid multilayer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948996A (ja) | 1984-03-21 |
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