JPS57139996A - Hybrid multilayer circuit board - Google Patents
Hybrid multilayer circuit boardInfo
- Publication number
- JPS57139996A JPS57139996A JP56025737A JP2573781A JPS57139996A JP S57139996 A JPS57139996 A JP S57139996A JP 56025737 A JP56025737 A JP 56025737A JP 2573781 A JP2573781 A JP 2573781A JP S57139996 A JPS57139996 A JP S57139996A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- hybrid multilayer
- hybrid
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56025737A JPS57139996A (en) | 1981-02-24 | 1981-02-24 | Hybrid multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56025737A JPS57139996A (en) | 1981-02-24 | 1981-02-24 | Hybrid multilayer circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57139996A true JPS57139996A (en) | 1982-08-30 |
Family
ID=12174125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56025737A Pending JPS57139996A (en) | 1981-02-24 | 1981-02-24 | Hybrid multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57139996A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948996A (en) * | 1982-09-13 | 1984-03-21 | 日本電気株式会社 | Multilayer printed circuit board and method of producing same |
JPS59215796A (en) * | 1983-05-24 | 1984-12-05 | 日本電気株式会社 | Thick film multilayer circuit board |
JPS60132392A (en) * | 1983-05-11 | 1985-07-15 | 日本電気株式会社 | High density multilayer circuit board |
JPS6224694A (en) * | 1985-07-25 | 1987-02-02 | 株式会社日立製作所 | Multilayer wiring board |
EP0433176A2 (en) * | 1989-12-15 | 1991-06-19 | TDK Corporation | A multilayer hybrid circuit |
JP2020097153A (en) * | 2018-12-18 | 2020-06-25 | 三星ダイヤモンド工業株式会社 | Method for manufacturing laminate ceramic chip, and method for manufacturing chip before firing for manufacturing laminate ceramic chip |
JP2020097154A (en) * | 2018-12-18 | 2020-06-25 | 三星ダイヤモンド工業株式会社 | Method for manufacturing laminate ceramic chip, and method for manufacturing chip before firing for manufacturing laminate ceramic chip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50526A (en) * | 1973-05-09 | 1975-01-07 | ||
JPS5028655A (en) * | 1973-07-17 | 1975-03-24 | ||
JPS5341190A (en) * | 1976-08-27 | 1978-04-14 | Ibm | Method of improving adhesion to polyimide layer of metallic layer |
-
1981
- 1981-02-24 JP JP56025737A patent/JPS57139996A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50526A (en) * | 1973-05-09 | 1975-01-07 | ||
JPS5028655A (en) * | 1973-07-17 | 1975-03-24 | ||
JPS5341190A (en) * | 1976-08-27 | 1978-04-14 | Ibm | Method of improving adhesion to polyimide layer of metallic layer |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948996A (en) * | 1982-09-13 | 1984-03-21 | 日本電気株式会社 | Multilayer printed circuit board and method of producing same |
JPS6338878B2 (en) * | 1982-09-13 | 1988-08-02 | Nippon Electric Co | |
JPH025022B2 (en) * | 1983-05-11 | 1990-01-31 | Nippon Electric Co | |
JPS60132392A (en) * | 1983-05-11 | 1985-07-15 | 日本電気株式会社 | High density multilayer circuit board |
JPS59215796A (en) * | 1983-05-24 | 1984-12-05 | 日本電気株式会社 | Thick film multilayer circuit board |
JPH025023B2 (en) * | 1983-05-24 | 1990-01-31 | Nippon Electric Co | |
JPS6224694A (en) * | 1985-07-25 | 1987-02-02 | 株式会社日立製作所 | Multilayer wiring board |
EP0433176A2 (en) * | 1989-12-15 | 1991-06-19 | TDK Corporation | A multilayer hybrid circuit |
EP0433176A3 (en) * | 1989-12-15 | 1992-12-30 | Tdk Corporation | A multilayer hybrid circuit |
EP0751571A2 (en) * | 1989-12-15 | 1997-01-02 | TDK Corporation | A multilayer hybrid circuit |
EP0751571A3 (en) * | 1989-12-15 | 1997-01-08 | TDK Corporation | A multilayer hybrid circuit |
JP2020097153A (en) * | 2018-12-18 | 2020-06-25 | 三星ダイヤモンド工業株式会社 | Method for manufacturing laminate ceramic chip, and method for manufacturing chip before firing for manufacturing laminate ceramic chip |
JP2020097154A (en) * | 2018-12-18 | 2020-06-25 | 三星ダイヤモンド工業株式会社 | Method for manufacturing laminate ceramic chip, and method for manufacturing chip before firing for manufacturing laminate ceramic chip |
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