JPS5792895A - Method of laminating printed board - Google Patents

Method of laminating printed board

Info

Publication number
JPS5792895A
JPS5792895A JP16910180A JP16910180A JPS5792895A JP S5792895 A JPS5792895 A JP S5792895A JP 16910180 A JP16910180 A JP 16910180A JP 16910180 A JP16910180 A JP 16910180A JP S5792895 A JPS5792895 A JP S5792895A
Authority
JP
Japan
Prior art keywords
printed board
laminating printed
laminating
board
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16910180A
Other languages
Japanese (ja)
Inventor
Haruyori Tanaka
Naoki Fukutomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Nippon Telegraph and Telephone Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP16910180A priority Critical patent/JPS5792895A/en
Publication of JPS5792895A publication Critical patent/JPS5792895A/en
Pending legal-status Critical Current

Links

JP16910180A 1980-12-02 1980-12-02 Method of laminating printed board Pending JPS5792895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16910180A JPS5792895A (en) 1980-12-02 1980-12-02 Method of laminating printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16910180A JPS5792895A (en) 1980-12-02 1980-12-02 Method of laminating printed board

Publications (1)

Publication Number Publication Date
JPS5792895A true JPS5792895A (en) 1982-06-09

Family

ID=15880321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16910180A Pending JPS5792895A (en) 1980-12-02 1980-12-02 Method of laminating printed board

Country Status (1)

Country Link
JP (1) JPS5792895A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598396A (en) * 1982-07-07 1984-01-17 株式会社日立製作所 Multilayer circuit board
JPS5948996A (en) * 1982-09-13 1984-03-21 日本電気株式会社 Multilayer printed circuit board and method of producing same
JPH01151293A (en) * 1987-12-09 1989-06-14 Mari Yamazaki Method for conducting inner layer of multilayer printed wiring board
JPH01135774U (en) * 1988-03-10 1989-09-18
JPH02178995A (en) * 1988-12-29 1990-07-11 Japan Radio Co Ltd Manufacture of multilayer printed board
JPH06232561A (en) * 1992-12-23 1994-08-19 Internatl Business Mach Corp <Ibm> Multilayer printed circuit board or card, manufacture thereof and ball dispenser
WO2002028662A1 (en) * 2000-10-02 2002-04-11 Matsushita Electric Industrial Co., Ltd. Card type recording medium and production method therefor
JP5012514B2 (en) * 2006-02-09 2012-08-29 日立化成工業株式会社 Multilayer wiring board manufacturing method
KR20200031112A (en) * 2017-06-28 2020-03-23 씨에라 써킷스 인코포레이티드 Multilayer circuit board using interposer layer and conductive paste

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598396A (en) * 1982-07-07 1984-01-17 株式会社日立製作所 Multilayer circuit board
JPS5948996A (en) * 1982-09-13 1984-03-21 日本電気株式会社 Multilayer printed circuit board and method of producing same
JPS6338878B2 (en) * 1982-09-13 1988-08-02 Nippon Electric Co
JPH01151293A (en) * 1987-12-09 1989-06-14 Mari Yamazaki Method for conducting inner layer of multilayer printed wiring board
JPH01135774U (en) * 1988-03-10 1989-09-18
JPH02178995A (en) * 1988-12-29 1990-07-11 Japan Radio Co Ltd Manufacture of multilayer printed board
JPH06232561A (en) * 1992-12-23 1994-08-19 Internatl Business Mach Corp <Ibm> Multilayer printed circuit board or card, manufacture thereof and ball dispenser
WO2002028662A1 (en) * 2000-10-02 2002-04-11 Matsushita Electric Industrial Co., Ltd. Card type recording medium and production method therefor
US6985363B2 (en) 2000-10-02 2006-01-10 Matsushita Electric Industrial Co., Ltd. Card type recording medium and production method therefor
JP5012514B2 (en) * 2006-02-09 2012-08-29 日立化成工業株式会社 Multilayer wiring board manufacturing method
KR20200031112A (en) * 2017-06-28 2020-03-23 씨에라 써킷스 인코포레이티드 Multilayer circuit board using interposer layer and conductive paste
EP3646369A4 (en) * 2017-06-28 2021-03-24 Catlam LLC Multi-layer circuit board using interposer layer and conductive paste
TWI776907B (en) * 2017-06-28 2022-09-11 美商凱特聯有限責任公司 A multi-layer circuit board formed from a top sub, and one or more composite layers, and a process for forming a multi-layer circuit board from a top sub and one or more adjacent pairs of an interposer layer adjacent to a sub layer

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