JPS5792895A - Method of laminating printed board - Google Patents
Method of laminating printed boardInfo
- Publication number
- JPS5792895A JPS5792895A JP16910180A JP16910180A JPS5792895A JP S5792895 A JPS5792895 A JP S5792895A JP 16910180 A JP16910180 A JP 16910180A JP 16910180 A JP16910180 A JP 16910180A JP S5792895 A JPS5792895 A JP S5792895A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- laminating printed
- laminating
- board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16910180A JPS5792895A (en) | 1980-12-02 | 1980-12-02 | Method of laminating printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16910180A JPS5792895A (en) | 1980-12-02 | 1980-12-02 | Method of laminating printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5792895A true JPS5792895A (en) | 1982-06-09 |
Family
ID=15880321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16910180A Pending JPS5792895A (en) | 1980-12-02 | 1980-12-02 | Method of laminating printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5792895A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS598396A (en) * | 1982-07-07 | 1984-01-17 | 株式会社日立製作所 | Multilayer circuit board |
JPS5948996A (en) * | 1982-09-13 | 1984-03-21 | 日本電気株式会社 | Multilayer printed circuit board and method of producing same |
JPH01151293A (en) * | 1987-12-09 | 1989-06-14 | Mari Yamazaki | Method for conducting inner layer of multilayer printed wiring board |
JPH01135774U (en) * | 1988-03-10 | 1989-09-18 | ||
JPH02178995A (en) * | 1988-12-29 | 1990-07-11 | Japan Radio Co Ltd | Manufacture of multilayer printed board |
JPH06232561A (en) * | 1992-12-23 | 1994-08-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board or card, manufacture thereof and ball dispenser |
WO2002028662A1 (en) * | 2000-10-02 | 2002-04-11 | Matsushita Electric Industrial Co., Ltd. | Card type recording medium and production method therefor |
JP5012514B2 (en) * | 2006-02-09 | 2012-08-29 | 日立化成工業株式会社 | Multilayer wiring board manufacturing method |
KR20200031112A (en) * | 2017-06-28 | 2020-03-23 | 씨에라 써킷스 인코포레이티드 | Multilayer circuit board using interposer layer and conductive paste |
-
1980
- 1980-12-02 JP JP16910180A patent/JPS5792895A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS598396A (en) * | 1982-07-07 | 1984-01-17 | 株式会社日立製作所 | Multilayer circuit board |
JPS5948996A (en) * | 1982-09-13 | 1984-03-21 | 日本電気株式会社 | Multilayer printed circuit board and method of producing same |
JPS6338878B2 (en) * | 1982-09-13 | 1988-08-02 | Nippon Electric Co | |
JPH01151293A (en) * | 1987-12-09 | 1989-06-14 | Mari Yamazaki | Method for conducting inner layer of multilayer printed wiring board |
JPH01135774U (en) * | 1988-03-10 | 1989-09-18 | ||
JPH02178995A (en) * | 1988-12-29 | 1990-07-11 | Japan Radio Co Ltd | Manufacture of multilayer printed board |
JPH06232561A (en) * | 1992-12-23 | 1994-08-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board or card, manufacture thereof and ball dispenser |
WO2002028662A1 (en) * | 2000-10-02 | 2002-04-11 | Matsushita Electric Industrial Co., Ltd. | Card type recording medium and production method therefor |
US6985363B2 (en) | 2000-10-02 | 2006-01-10 | Matsushita Electric Industrial Co., Ltd. | Card type recording medium and production method therefor |
JP5012514B2 (en) * | 2006-02-09 | 2012-08-29 | 日立化成工業株式会社 | Multilayer wiring board manufacturing method |
KR20200031112A (en) * | 2017-06-28 | 2020-03-23 | 씨에라 써킷스 인코포레이티드 | Multilayer circuit board using interposer layer and conductive paste |
EP3646369A4 (en) * | 2017-06-28 | 2021-03-24 | Catlam LLC | Multi-layer circuit board using interposer layer and conductive paste |
TWI776907B (en) * | 2017-06-28 | 2022-09-11 | 美商凱特聯有限責任公司 | A multi-layer circuit board formed from a top sub, and one or more composite layers, and a process for forming a multi-layer circuit board from a top sub and one or more adjacent pairs of an interposer layer adjacent to a sub layer |
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