JPS6338856B2 - - Google Patents
Info
- Publication number
- JPS6338856B2 JPS6338856B2 JP56089495A JP8949581A JPS6338856B2 JP S6338856 B2 JPS6338856 B2 JP S6338856B2 JP 56089495 A JP56089495 A JP 56089495A JP 8949581 A JP8949581 A JP 8949581A JP S6338856 B2 JPS6338856 B2 JP S6338856B2
- Authority
- JP
- Japan
- Prior art keywords
- feedthrough capacitor
- laminate
- chip
- ground conductor
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 45
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089495A JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089495A JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57206016A JPS57206016A (en) | 1982-12-17 |
| JPS6338856B2 true JPS6338856B2 (cs) | 1988-08-02 |
Family
ID=13972333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56089495A Granted JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57206016A (cs) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621220Y2 (ja) * | 1987-09-02 | 1994-06-01 | キヤノン株式会社 | リードレス部品装置 |
| JP3231350B2 (ja) * | 1991-05-08 | 2001-11-19 | 松下電器産業株式会社 | コンデンサネットワーク |
| KR101444536B1 (ko) * | 2012-10-18 | 2014-09-24 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조방법 |
| CN109637808B (zh) * | 2019-01-11 | 2024-02-23 | 芯百特微电子(无锡)有限公司 | 一种新型电容器及装置 |
-
1981
- 1981-06-12 JP JP56089495A patent/JPS57206016A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57206016A (en) | 1982-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4953988B2 (ja) | 積層コンデンサおよびコンデンサ実装基板 | |
| US4322698A (en) | Laminated electronic parts and process for making the same | |
| KR100970838B1 (ko) | 적층 세라믹 커패시터 | |
| US9236184B2 (en) | Monolithic ceramic electronic component and method for manufacturing the same | |
| JPH11103229A (ja) | 高周波部品およびその製造方法 | |
| JP3087495B2 (ja) | コンデンサおよびシールドケース | |
| JP6232836B2 (ja) | コンデンサ素子 | |
| JP2000252131A (ja) | 積層チップ部品 | |
| JPS5923458B2 (ja) | 複合部品 | |
| JPH1140459A (ja) | 複合電子部品 | |
| JP2001155953A (ja) | 三次元搭載用多端子積層セラミックコンデンサ | |
| JPS6338856B2 (cs) | ||
| JPH0737757A (ja) | コンデンサアレイ | |
| EP1605477B1 (en) | Multilayer ceramic capacitor for three-dimensional mounting | |
| JP2001155952A (ja) | 三次元搭載用三端子積層セラミックコンデンサ | |
| JP2012146940A (ja) | 電子部品および電子装置 | |
| JPH0215411Y2 (cs) | ||
| JP2571389B2 (ja) | 積層型混成集積回路部品 | |
| JP2839262B2 (ja) | チップ抵抗器とその製造方法 | |
| JP2006066443A (ja) | 表面実装型多連コンデンサ | |
| JPS6031242Y2 (ja) | Ｌｃ複合部品 | |
| JP2003151830A (ja) | 積層型電子部品 | |
| JP3166158B2 (ja) | 積層回路部品の構造 | |
| JPH0142333Y2 (cs) | ||
| JP2000114100A (ja) | 多連型電子部品 |