JPS6338412B2 - - Google Patents
Info
- Publication number
- JPS6338412B2 JPS6338412B2 JP60208095A JP20809585A JPS6338412B2 JP S6338412 B2 JPS6338412 B2 JP S6338412B2 JP 60208095 A JP60208095 A JP 60208095A JP 20809585 A JP20809585 A JP 20809585A JP S6338412 B2 JPS6338412 B2 JP S6338412B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- grain size
- following
- alloy
- average grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 13
- 239000002244 precipitate Substances 0.000 claims description 13
- 229910052726 zirconium Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 7
- 239000000047 product Substances 0.000 claims 6
- 230000000694 effects Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 8
- 239000000126 substance Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20809585A JPS6270540A (ja) | 1985-09-20 | 1985-09-20 | 半導体装置用Cu合金リ−ド素材 |
US06/903,514 US4749548A (en) | 1985-09-13 | 1986-09-03 | Copper alloy lead material for use in semiconductor device |
GB8621958A GB2181742B (en) | 1985-09-13 | 1986-09-11 | Copper alloy lead material for use in semiconductor device |
DE19863631119 DE3631119A1 (de) | 1985-09-13 | 1986-09-12 | Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen |
US07/166,217 US4872048A (en) | 1985-09-13 | 1988-03-10 | Semiconductor device having copper alloy leads |
GB8907058A GB2219473B (en) | 1985-09-13 | 1989-03-29 | Copper alloy lead material for use in semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20809585A JPS6270540A (ja) | 1985-09-20 | 1985-09-20 | 半導体装置用Cu合金リ−ド素材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6270540A JPS6270540A (ja) | 1987-04-01 |
JPS6338412B2 true JPS6338412B2 (zh) | 1988-07-29 |
Family
ID=16550552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20809585A Granted JPS6270540A (ja) | 1985-09-13 | 1985-09-20 | 半導体装置用Cu合金リ−ド素材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6270540A (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62130247A (ja) * | 1985-11-29 | 1987-06-12 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
JPS6299431A (ja) * | 1985-10-24 | 1987-05-08 | Mitsubishi Electric Corp | 半導体装置用リードフレーム材 |
JPS63171841A (ja) * | 1988-01-11 | 1988-07-15 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
JPH01306534A (ja) * | 1988-05-31 | 1989-12-11 | Yazaki Corp | 細線用銅合金導体 |
JPH01312047A (ja) * | 1988-06-13 | 1989-12-15 | Yazaki Corp | 高力高導電性銅合金の製造方法 |
JP3431139B2 (ja) * | 1990-05-31 | 2003-07-28 | 株式会社東芝 | リードフレームとその製造方法および半導体パッケージ |
JPH04136819U (ja) * | 1991-03-29 | 1992-12-21 | タツタ電線株式会社 | 耐油・耐薬品・耐摩耗・耐屈曲・可撓性ケーブル |
JP2005113259A (ja) * | 2003-02-05 | 2005-04-28 | Sumitomo Metal Ind Ltd | Cu合金およびその製造方法 |
JP5060625B2 (ja) * | 2011-02-18 | 2012-10-31 | 三菱伸銅株式会社 | Cu−Zr系銅合金板及びその製造方法 |
CN111663062B (zh) * | 2020-05-22 | 2021-04-16 | 陕西斯瑞新材料股份有限公司 | 一种利用热等静压近净成型制备Cu-Cr-Mg-Zr-Ce高性能端环的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5319136A (en) * | 1976-08-06 | 1978-02-22 | Kabel Metallwerke Ghh | Method of using copper alloy as mold material for continuous casting |
JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
JPS56102537A (en) * | 1980-01-16 | 1981-08-17 | Toshiba Corp | Copper alloy member |
JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
-
1985
- 1985-09-20 JP JP20809585A patent/JPS6270540A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5319136A (en) * | 1976-08-06 | 1978-02-22 | Kabel Metallwerke Ghh | Method of using copper alloy as mold material for continuous casting |
JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
JPS56102537A (en) * | 1980-01-16 | 1981-08-17 | Toshiba Corp | Copper alloy member |
JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
Also Published As
Publication number | Publication date |
---|---|
JPS6270540A (ja) | 1987-04-01 |
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