JPS6335710B2 - - Google Patents

Info

Publication number
JPS6335710B2
JPS6335710B2 JP57163081A JP16308182A JPS6335710B2 JP S6335710 B2 JPS6335710 B2 JP S6335710B2 JP 57163081 A JP57163081 A JP 57163081A JP 16308182 A JP16308182 A JP 16308182A JP S6335710 B2 JPS6335710 B2 JP S6335710B2
Authority
JP
Japan
Prior art keywords
targets
substrate
opposing
target
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57163081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5953680A (ja
Inventor
Sadao Kadokura
Kazuhiko Pponjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP16308182A priority Critical patent/JPS5953680A/ja
Publication of JPS5953680A publication Critical patent/JPS5953680A/ja
Publication of JPS6335710B2 publication Critical patent/JPS6335710B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP16308182A 1982-09-21 1982-09-21 スパツタ装置 Granted JPS5953680A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16308182A JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16308182A JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS5953680A JPS5953680A (ja) 1984-03-28
JPS6335710B2 true JPS6335710B2 (enExample) 1988-07-15

Family

ID=15766817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16308182A Granted JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS5953680A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666788A (en) * 1982-02-16 1987-05-19 Teijin Limited Perpendicular magnetic recording medium, method for producing the same, and sputtering device
JP2587924B2 (ja) * 1986-10-11 1997-03-05 日本電信電話株式会社 薄膜形成装置
JPS63270461A (ja) * 1986-12-26 1988-11-08 Teijin Ltd 対向ターゲット式スパッタ装置
CN100432286C (zh) * 2003-12-31 2008-11-12 天津大学 多副对向靶薄膜溅射仪
KR20070030620A (ko) * 2005-09-13 2007-03-16 삼성에스디아이 주식회사 전극 증착방법 및 이로써 제조된 유기 발광 표시장치
JP4717896B2 (ja) * 2006-01-25 2011-07-06 株式会社アルバック スパッタリング装置及び成膜方法
KR20140073239A (ko) * 2012-12-06 2014-06-16 삼성디스플레이 주식회사 스퍼터링 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus
JPS58189371A (ja) * 1982-04-28 1983-11-05 Teijin Ltd スパツタ装置

Also Published As

Publication number Publication date
JPS5953680A (ja) 1984-03-28

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