JPS6335380B2 - - Google Patents

Info

Publication number
JPS6335380B2
JPS6335380B2 JP57008883A JP888382A JPS6335380B2 JP S6335380 B2 JPS6335380 B2 JP S6335380B2 JP 57008883 A JP57008883 A JP 57008883A JP 888382 A JP888382 A JP 888382A JP S6335380 B2 JPS6335380 B2 JP S6335380B2
Authority
JP
Japan
Prior art keywords
grinding wheel
piece
workpiece
grindstone
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57008883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58126056A (ja
Inventor
Shigeru Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP888382A priority Critical patent/JPS58126056A/ja
Priority to US06/377,008 priority patent/US4517769A/en
Priority to GB8214280A priority patent/GB2098893B/en
Priority to DE3218953A priority patent/DE3218953C2/de
Publication of JPS58126056A publication Critical patent/JPS58126056A/ja
Publication of JPS6335380B2 publication Critical patent/JPS6335380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP888382A 1981-05-20 1982-01-25 斜め溝加工方法 Granted JPS58126056A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP888382A JPS58126056A (ja) 1982-01-25 1982-01-25 斜め溝加工方法
US06/377,008 US4517769A (en) 1981-05-20 1982-05-11 Method and apparatus for forming oblique groove in semiconductor device
GB8214280A GB2098893B (en) 1981-05-20 1982-05-17 Method and apparatus for forming oblique groove in semiconductor device
DE3218953A DE3218953C2 (de) 1981-05-20 1982-05-19 Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP888382A JPS58126056A (ja) 1982-01-25 1982-01-25 斜め溝加工方法

Publications (2)

Publication Number Publication Date
JPS58126056A JPS58126056A (ja) 1983-07-27
JPS6335380B2 true JPS6335380B2 (it) 1988-07-14

Family

ID=11705069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP888382A Granted JPS58126056A (ja) 1981-05-20 1982-01-25 斜め溝加工方法

Country Status (1)

Country Link
JP (1) JPS58126056A (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632288Y2 (ja) * 1985-10-01 1994-08-24 ワシノ機械株式会社 光▲ほう▼い研削盤
JPH01218027A (ja) * 1988-02-26 1989-08-31 Fuji Electric Co Ltd 半導体装置の製造方法
JPH01264758A (ja) * 1988-04-14 1989-10-23 Nippon Inter Electronics Corp 半導体装置の加工装置ならびにに製造方法
JP3426544B2 (ja) * 1999-08-30 2003-07-14 理化学研究所 中性子レンズ部材の加工装置及び方法
KR20030064539A (ko) * 2002-01-28 2003-08-02 배영철 엔드밀을 이용한 홈가공 장치 및 방법
JP5399229B2 (ja) * 2009-12-25 2014-01-29 日本碍子株式会社 複合基板及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108086A (en) * 1978-02-13 1979-08-24 Nobumasa Fujishiro Method of forming groove by means of saw machine and milling machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108086A (en) * 1978-02-13 1979-08-24 Nobumasa Fujishiro Method of forming groove by means of saw machine and milling machine

Also Published As

Publication number Publication date
JPS58126056A (ja) 1983-07-27

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