JPS633478B2 - - Google Patents

Info

Publication number
JPS633478B2
JPS633478B2 JP53074399A JP7439978A JPS633478B2 JP S633478 B2 JPS633478 B2 JP S633478B2 JP 53074399 A JP53074399 A JP 53074399A JP 7439978 A JP7439978 A JP 7439978A JP S633478 B2 JPS633478 B2 JP S633478B2
Authority
JP
Japan
Prior art keywords
power supply
supply wiring
circuit board
signal lines
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53074399A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54164252A (en
Inventor
Takayasu Handa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7439978A priority Critical patent/JPS54164252A/ja
Publication of JPS54164252A publication Critical patent/JPS54164252A/ja
Publication of JPS633478B2 publication Critical patent/JPS633478B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP7439978A 1978-06-19 1978-06-19 Hybrid integrated circuit board Granted JPS54164252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7439978A JPS54164252A (en) 1978-06-19 1978-06-19 Hybrid integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7439978A JPS54164252A (en) 1978-06-19 1978-06-19 Hybrid integrated circuit board

Publications (2)

Publication Number Publication Date
JPS54164252A JPS54164252A (en) 1979-12-27
JPS633478B2 true JPS633478B2 (de) 1988-01-23

Family

ID=13546060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7439978A Granted JPS54164252A (en) 1978-06-19 1978-06-19 Hybrid integrated circuit board

Country Status (1)

Country Link
JP (1) JPS54164252A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463277U (de) * 1990-10-04 1992-05-29
JPH04111477U (ja) * 1991-03-19 1992-09-28 株式会社タク・プロジエクト 名 刺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314469B2 (de) * 1974-05-17 1978-05-17

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816176Y2 (ja) * 1976-07-16 1983-04-01 三洋電機株式会社 大規模集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314469B2 (de) * 1974-05-17 1978-05-17

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463277U (de) * 1990-10-04 1992-05-29
JPH04111477U (ja) * 1991-03-19 1992-09-28 株式会社タク・プロジエクト 名 刺

Also Published As

Publication number Publication date
JPS54164252A (en) 1979-12-27

Similar Documents

Publication Publication Date Title
JPH1056249A (ja) 埋込み減結合容量を有するプリント回路基板及びその作製方法
JPS633478B2 (de)
JPS6221260B2 (de)
JPH0363237B2 (de)
JP3246166B2 (ja) 薄膜コンデンサ
JPH0525194B2 (de)
JP2621342B2 (ja) 多層配線基板
JPS58204516A (ja) 厚膜多層回路板
JPS628040B2 (de)
JP2739453B2 (ja) ヒューズ機能付コンデンサ、及びその製造方法
JPS6149491A (ja) セラミツク多層配線基板
JPS6370442A (ja) 多層配線基板
JPH0426184A (ja) 厚膜回路基板
JPH0225276B2 (de)
JPH0239878B2 (de)
JP3865428B2 (ja) チップ複合電子部品
JPS63239970A (ja) 半導体装置
JPS5915094Y2 (ja) 多層印刷配線板
JPH0555751A (ja) 薄膜多層回路基板
JPH04280496A (ja) コンデンサ内蔵セラミック多層回路基板及びその製造方法
JPS60253303A (ja) マイクロストリツプ線路
JPS5936922Y2 (ja) 混成集積回路装置
JPH0367357B2 (de)
JPS62213194A (ja) 厚膜回路基板とその製造方法
JPH02271596A (ja) 多層ハイブリッド回路の製造方法