JPS6331940B2 - - Google Patents

Info

Publication number
JPS6331940B2
JPS6331940B2 JP57224704A JP22470482A JPS6331940B2 JP S6331940 B2 JPS6331940 B2 JP S6331940B2 JP 57224704 A JP57224704 A JP 57224704A JP 22470482 A JP22470482 A JP 22470482A JP S6331940 B2 JPS6331940 B2 JP S6331940B2
Authority
JP
Japan
Prior art keywords
ceramic
tungsten
semiconductor device
container
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57224704A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59114845A (ja
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57224704A priority Critical patent/JPS59114845A/ja
Publication of JPS59114845A publication Critical patent/JPS59114845A/ja
Publication of JPS6331940B2 publication Critical patent/JPS6331940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP57224704A 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置 Granted JPS59114845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Publications (2)

Publication Number Publication Date
JPS59114845A JPS59114845A (ja) 1984-07-03
JPS6331940B2 true JPS6331940B2 (enrdf_load_stackoverflow) 1988-06-27

Family

ID=16817932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224704A Granted JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Country Status (1)

Country Link
JP (1) JPS59114845A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0714127B1 (en) * 1991-11-28 2003-01-29 Kabushiki Kaisha Toshiba Semiconductor package
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ

Also Published As

Publication number Publication date
JPS59114845A (ja) 1984-07-03

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