JPS633165Y2 - - Google Patents
Info
- Publication number
- JPS633165Y2 JPS633165Y2 JP17357883U JP17357883U JPS633165Y2 JP S633165 Y2 JPS633165 Y2 JP S633165Y2 JP 17357883 U JP17357883 U JP 17357883U JP 17357883 U JP17357883 U JP 17357883U JP S633165 Y2 JPS633165 Y2 JP S633165Y2
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- lead
- bending
- support mechanism
- guide bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 57
- 230000007246 mechanism Effects 0.000 claims description 51
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17357883U JPS6079753U (ja) | 1983-11-08 | 1983-11-08 | 半導体リ−ドフレ−ムのリ−ド折曲装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17357883U JPS6079753U (ja) | 1983-11-08 | 1983-11-08 | 半導体リ−ドフレ−ムのリ−ド折曲装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6079753U JPS6079753U (ja) | 1985-06-03 |
| JPS633165Y2 true JPS633165Y2 (enrdf_load_stackoverflow) | 1988-01-26 |
Family
ID=30378098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17357883U Granted JPS6079753U (ja) | 1983-11-08 | 1983-11-08 | 半導体リ−ドフレ−ムのリ−ド折曲装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6079753U (enrdf_load_stackoverflow) |
-
1983
- 1983-11-08 JP JP17357883U patent/JPS6079753U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6079753U (ja) | 1985-06-03 |
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