JPS6331499B2 - - Google Patents

Info

Publication number

JPS6331499B2

JPS6331499B2 JP3000179A JP3000179A JPS6331499B2 JP S6331499 B2 JPS6331499 B2 JP S6331499B2 JP 3000179 A JP3000179 A JP 3000179A JP 3000179 A JP3000179 A JP 3000179A JP S6331499 B2 JPS6331499 B2 JP S6331499B2

Authority

JP

Japan

Prior art keywords

formula

general formula

weight

solution

present

Prior art date

1979-03-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 10
• 239000004642 Polyimide Substances 0.000 claims description 9
• -1 maleimide compound Chemical class 0.000 claims description 9
• 229920001721 polyimide Polymers 0.000 claims description 9
• 239000011342 resin composition Substances 0.000 claims description 7
• 229920001187 thermosetting polymer Polymers 0.000 claims description 7
• 125000000217 alkyl group Chemical group 0.000 claims description 4
• 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
• UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 claims description 3
• 239000003960 organic solvent Substances 0.000 claims description 3
• ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
• 229920005989 resin Polymers 0.000 description 7
• 239000011347 resin Substances 0.000 description 7
• HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 5
• SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
• 239000000203 mixture Substances 0.000 description 5
• 239000012778 molding material Substances 0.000 description 5
• 239000000047 product Substances 0.000 description 5
• XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 4
• 150000003923 2,5-pyrrolediones Chemical class 0.000 description 4
• 239000000463 material Substances 0.000 description 4
• 229920003192 poly(bis maleimide) Polymers 0.000 description 3
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
• YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
• VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
• 125000003118 aryl group Chemical group 0.000 description 2
• 238000005452 bending Methods 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 238000001035 drying Methods 0.000 description 2
• 239000004744 fabric Substances 0.000 description 2
• 239000011521 glass Substances 0.000 description 2
• 239000002904 solvent Substances 0.000 description 2
• 238000005979 thermal decomposition reaction Methods 0.000 description 2
• WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
• QDEQBRUNBFJJPW-UHFFFAOYSA-N 1-(3-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC(N2C(C=CC2=O)=O)=C1 QDEQBRUNBFJJPW-UHFFFAOYSA-N 0.000 description 1
• WAPYNKVCEKOHBE-UHFFFAOYSA-N 3-nitro-4-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C([N+](=O)[O-])=C1C1=CC=CC=C1 WAPYNKVCEKOHBE-UHFFFAOYSA-N 0.000 description 1
• RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 1
• PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
• FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 230000002411 adverse Effects 0.000 description 1
• 125000003277 amino group Chemical group 0.000 description 1
• 238000009529 body temperature measurement Methods 0.000 description 1
• 238000006243 chemical reaction Methods 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 230000003247 decreasing effect Effects 0.000 description 1
• 238000007872 degassing Methods 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000000706 filtrate Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 229920001519 homopolymer Polymers 0.000 description 1
• 150000003949 imides Chemical class 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 238000013507 mapping Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 239000003973 paint Substances 0.000 description 1
• 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
• 229920000768 polyamine Polymers 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 239000002244 precipitate Substances 0.000 description 1
• 239000000126 substance Substances 0.000 description 1