JPS6331394Y2 - - Google Patents

Info

Publication number
JPS6331394Y2
JPS6331394Y2 JP1983025463U JP2546383U JPS6331394Y2 JP S6331394 Y2 JPS6331394 Y2 JP S6331394Y2 JP 1983025463 U JP1983025463 U JP 1983025463U JP 2546383 U JP2546383 U JP 2546383U JP S6331394 Y2 JPS6331394 Y2 JP S6331394Y2
Authority
JP
Japan
Prior art keywords
plate
metal
container
ceramic
thick plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983025463U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59131163U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983025463U priority Critical patent/JPS59131163U/ja
Publication of JPS59131163U publication Critical patent/JPS59131163U/ja
Application granted granted Critical
Publication of JPS6331394Y2 publication Critical patent/JPS6331394Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
JP1983025463U 1983-02-23 1983-02-23 半導体容器 Granted JPS59131163U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983025463U JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983025463U JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Publications (2)

Publication Number Publication Date
JPS59131163U JPS59131163U (ja) 1984-09-03
JPS6331394Y2 true JPS6331394Y2 (cs) 1988-08-22

Family

ID=30156448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983025463U Granted JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Country Status (1)

Country Link
JP (1) JPS59131163U (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763080B2 (ja) * 1986-02-27 1995-07-05 株式会社日立製作所 半導体パツケ−ジ構造体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810360Y2 (ja) * 1976-07-09 1983-02-25 日本電気株式会社 半導体装置用パツケ−ジ
JPS5317072A (en) * 1976-07-30 1978-02-16 Nec Corp Package for semiconductor device
JPS5461472A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Package for semiconductor element

Also Published As

Publication number Publication date
JPS59131163U (ja) 1984-09-03

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