JPS59131163U - 半導体容器 - Google Patents

半導体容器

Info

Publication number
JPS59131163U
JPS59131163U JP1983025463U JP2546383U JPS59131163U JP S59131163 U JPS59131163 U JP S59131163U JP 1983025463 U JP1983025463 U JP 1983025463U JP 2546383 U JP2546383 U JP 2546383U JP S59131163 U JPS59131163 U JP S59131163U
Authority
JP
Japan
Prior art keywords
semiconductor container
metal
semiconductor
container
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983025463U
Other languages
English (en)
Other versions
JPS6331394Y2 (ja
Inventor
青井　保典
Original Assignee
日本特殊陶業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本特殊陶業株式会社 filed Critical 日本特殊陶業株式会社
Priority to JP1983025463U priority Critical patent/JPS59131163U/ja
Publication of JPS59131163U publication Critical patent/JPS59131163U/ja
Application granted granted Critical
Publication of JPS6331394Y2 publication Critical patent/JPS6331394Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａ、　Ｂ、　Ｃ，Ｄ図は従来構造の断面図、第２
図Ａ、　Ｂ、　Ｃ図は本考案の断面図である。 １．１１・・・セラミック、２．１２・・・モリブデン
金属、３，１３・・・ＩＣ素子、４．１４・・・外部り
−ドピン、５．１５・・・キャップ、６．１６・・・Ｆ
ｅ　−Ｎｉ系合金板、７・・・メタライズ。

Claims (3)

    【実用新案登録請求の範囲】
  1. （１）集積回路素子を収納する半導体容器において、そ
    の集積回路素子の取り付は部に熱伝導性に優れた金属を
    使用し、該金属と容器間に異種金属を介在させて取り付
    けたことを特徴とする半導体容器。
  2. （２）熱伝導性に優れた金属とは、モリブデン、タング
    ステン又はそれらの合金等である実用新案登録請求の範
    囲第１項記載の半導体容器。
  3. （３）介在させる異種金属は、Ｆｅ　−Ｎｉ系合金又は
    無酸素銅等である実用新案登録請求の範囲第１項記載の
    半導体容器。
JP1983025463U 1983-02-23 1983-02-23 半導体容器 Granted JPS59131163U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983025463U JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983025463U JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Publications (2)

Publication Number Publication Date
JPS59131163U true JPS59131163U (ja) 1984-09-03
JPS6331394Y2 JPS6331394Y2 (ja) 1988-08-22

Family

ID=30156448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983025463U Granted JPS59131163U (ja) 1983-02-23 1983-02-23 半導体容器

Country Status (1)

Country Link
JP (1) JPS59131163U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199038A (ja) * 1986-02-27 1987-09-02 Hitachi Ltd 半導体パツケ−ジ構造体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310273U (ja) * 1976-07-09 1978-01-27
JPS5317072A (en) * 1976-07-30 1978-02-16 Nec Corp Package for semiconductor device
JPS5461472A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Package for semiconductor element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310273U (ja) * 1976-07-09 1978-01-27
JPS5317072A (en) * 1976-07-30 1978-02-16 Nec Corp Package for semiconductor device
JPS5461472A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Package for semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199038A (ja) * 1986-02-27 1987-09-02 Hitachi Ltd 半導体パツケ−ジ構造体

Also Published As

Publication number Publication date
JPS6331394Y2 (ja) 1988-08-22

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