JPS6331394Y2 - - Google Patents
Info
- Publication number
- JPS6331394Y2 JPS6331394Y2 JP1983025463U JP2546383U JPS6331394Y2 JP S6331394 Y2 JPS6331394 Y2 JP S6331394Y2 JP 1983025463 U JP1983025463 U JP 1983025463U JP 2546383 U JP2546383 U JP 2546383U JP S6331394 Y2 JPS6331394 Y2 JP S6331394Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- metal
- container
- ceramic
- thick plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983025463U JPS59131163U (ja) | 1983-02-23 | 1983-02-23 | 半導体容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983025463U JPS59131163U (ja) | 1983-02-23 | 1983-02-23 | 半導体容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59131163U JPS59131163U (ja) | 1984-09-03 |
| JPS6331394Y2 true JPS6331394Y2 (cg-RX-API-DMAC7.html) | 1988-08-22 |
Family
ID=30156448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983025463U Granted JPS59131163U (ja) | 1983-02-23 | 1983-02-23 | 半導体容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59131163U (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0763080B2 (ja) * | 1986-02-27 | 1995-07-05 | 株式会社日立製作所 | 半導体パツケ−ジ構造体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810360Y2 (ja) * | 1976-07-09 | 1983-02-25 | 日本電気株式会社 | 半導体装置用パツケ−ジ |
| JPS5317072A (en) * | 1976-07-30 | 1978-02-16 | Nec Corp | Package for semiconductor device |
| JPS5461472A (en) * | 1977-10-26 | 1979-05-17 | Hitachi Ltd | Package for semiconductor element |
-
1983
- 1983-02-23 JP JP1983025463U patent/JPS59131163U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59131163U (ja) | 1984-09-03 |