JPS6331143A - Socket for semiconductor device - Google Patents

Abstract

PURPOSE:To enlarge the areas of electrical contact parts to two times or more and to contrive a decrease in the electrical contact resistance by a method wherein at least two independent electrodes are provided to each lead of an IC at the time of installation of the IC and also, the two independent electrodes are held at the same potential. CONSTITUTION:In a state that an IC is installed, the bottom surfaces of leads A3 of the IC respectively come into contact to each electrode A2 and the upper surfaces of the leads A3 respectively come into contact to each electrode B5. These independent electrodes A2 and electrodes B5 are electrically held at the same potential by lead wires 6. Thereby, each lead A3 of the IC comes to have two contact parts, the electrical contact resistance becomes smaller and a stable and high-reproducibility electrical contact can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for a semiconductor device, and in particular, to a socket for a semiconductor device, and in particular to a socket for a semiconductor device between a lead of a flat package type semiconductor device and the flat hall cage and an electrode of the socket for the semiconductor device. The present invention relates to a socket for semiconductor devices that improves electrical contact.

[Conventional technology]

Conventionally, in this type of semiconductor device socket (hereinafter referred to as IC socket), when a flat package type semiconductor device (hereinafter referred to as IC) is mounted, an IC socket is used to make electrical contact with the IC lead. The electrode is located at the bottom of the IC lead, and is kept in contact with the IC lead at only one point. Moreover,
In order to maintain stable electrical contact, a top cover is provided that acts to hold down the IC leads from above.

[Problem that the invention seeks to solve]

The above-described conventional IC socket has the drawback that poor contact often occurs because the electrical contact between the IC lead and the electrode of the IC socket is limited to only one location. For example, in an IC such as a linear IC that operates at a relatively large current and requires precision in electrical characteristics, an increase in contact resistance due to the aforementioned contact failure cannot be ignored, resulting in a characteristic failure. This causes a decrease in production yield. In addition, in IC reliability evaluation tests, etc.
If the surface of the lead is oxidized or contaminated, contact failure may occur frequently, resulting in poor characteristics.
Furthermore, variations in electrical characteristic values may occur, leading to unreliable data.

That is, conventional IC sockets have various drawbacks due to the poor contact.

[Means for solving problems]

The IC socket of the present invention is a socket for a flat package type semiconductor device, and when the flat package type semiconductor device is mounted, the IC socket is in electrical contact with one lead of the flat package type semiconductor device, and
At least two or more independent electrodes electrically connected so as to be held at the same potential are provided corresponding to each lead of the flat package type semiconductor device.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are perspective views of an embodiment of the present invention. 1 supports the IC, and electrode (A) 2 and the IC
This is the IC socket body for fixing the lead (A) 3 of the socket. 4 is the upper lid for mounting and fixing the IC, and 5 is the electrode (B) on the upper lid side that is paired with electrode (A) 2.
). 6 is an independent electrode (A) 2 and an electrode (
B) This is a lead wire for keeping 5 electrically at the same potential.

These structures are configured similarly for all electrodes. When the IC is attached, the bottom surface of the lead (A) 3 of the IC comes into contact with the electrode (A) 2, and the top surface of the lead (A) 3 comes into contact with the electrode (B) 5.

These independent electrodes (A) 2 and (B) 5 are kept at the same electrical potential by the lead 1M6, so
As a result, the IC lead 43 has two contact portions, and electrical contact resistance is small, making it possible to realize stable electrical contact with high reproducibility. In addition, the first
In Figures (a) and (b), the state in which the IC is mounted and the type of clasp for crimping and fixing the upper cover 4 and the IC socket body 1 are omitted.

Next, other embodiments of the present invention will be described.

FIG. 2 is a perspective view showing a portion of the other embodiment. 1 to 5 in Fig. 2 are Fig. 1 (a) and (b), respectively.
), the IC socket main body 1, electrode (A) 2, lead (A) 3, upper cover 4, and electrode (
B) Same as 5. 7 is an electrode (q) formed by extending the electrode (A) 2; 9 is an electrode η formed by extending the electrode (B) 5; 8 is an electrode (at the same potential as q7); It is a metal pin that is connected and embedded in the IC socket main body 1 and can be moved up and down by a built-in spring.

Such a structure is configured similarly for all electrodes.・Next, what is shown in FIG. 3 is a partial side view showing the state in which the IC is installed in the embodiment shown in FIG. Also, the top surface of the lead (Bill) is in contact with the electrode (B) 5. At the same time, the metal pin 8 is crimped to the electrode 9 by the pressure of the spring, so as a result The lead (B) 1-1 has two contact portions, and the electrical contact resistance is small, making it possible to realize stable electrical contact with high reproducibility.

〔Effect of the invention〕

As explained above, the present invention provides at least two independent electrodes for the leads of the IC and maintains the two independent electrodes at the same potential when the IC is mounted. This has the effect that the area of the electrical contact portion can be doubled or more, the electrical contact resistance can be reduced, and electrical contact can be realized with stability and high reproducibility.

[Brief explanation of drawings]

1(a) and (b) are perspective views of one embodiment of the present invention, FIG. 2 is a perspective view showing parts of another embodiment, and FIG. 3 is an IC FIG. In the figure, 1...IC socket body, 2...old electrode (A), 3...lead (5), 4...
...Top lid, 5...Electrode (B), 6...
... Lead wire, 7... Electrode (q, 8...
・Pin, 9... Electrode port, 10... IC
, 11... Lead (B). cb no.1 diagram

Claims (1)

[Claims] In a socket for a flat package type semiconductor device, when the flat package type semiconductor device is attached,
At least two or more independent electrodes corresponding to one lead of the flat package type semiconductor device are electrically connected to each other so as to be in electrical contact with each other and are both held at the same potential. A socket for a semiconductor device characterized by being provided corresponding to each lead of a packaged semiconductor device.