JPS62248693A - Semiconductor card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a package for a semiconductor card such as an IC card, particularly a semiconductor card module.

[Conventional technology]

-m There are various types of semiconductor cards, but here we will explain the most versatile IC card.

For example, the conventional IC shown in the old Japanese Patent Application Publication No. 53-64
The card is constructed as shown in FIGS. 4 and 5. That is, in FIGS. 4 and 5, 1 is an IC card body, 2 is an IC card module embedded in the TC card body 1 and has a built-in semiconductor element, 21 is a side surface of the IC card module, and 3 is an external electrode. It is.

In this conventional device, when operating the semiconductor element inside the IC card module 2, the IC card is inserted into an external device (not shown), the electrodes 3 of the IC card are brought into contact with the electrodes of the external device, and an electrical connection is made through those electrodes. Signals are exchanged.

[Problem that the invention seeks to solve]

In this conventional device, the exchange of electrical signals between the semiconductor, etc. built in the IC card module 2 and other semiconductor devices and electric/electronic components is performed only through the electrode 3 on the surface, so that, for example, when one IC There have been problems such as the inability to provide other functions to the IC card by incorporating another IC card module into the card.

This invention was made to solve the problems of the conventional products, and by providing new terminals for electrical connection on the side, top, or bottom surface of the semiconductor card module package, thin semiconductors such as IC cards can be used. The purpose is to be able to incorporate multiple electrically connected modules into a card, and to incorporate other electrical and electronic components into a single card so that they work in conjunction with the semiconductor elements within the module. Furthermore, it is intended to enable interlocking with other semiconductor devices and electrical/electronic parts through terminals provided on the side surfaces.

[Means for solving problems]

In the semiconductor card according to the present invention, a semiconductor card module disposed within a semiconductor card main body is provided with a terminal to be connected to another electrical component.

[Function] In this invention, since the semiconductor card module is provided with terminals, it is easy to connect to other semiconductor devices and electric/electronic parts inside or outside the semiconductor card9. You can add new functionality.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. That is, in FIG. 1, 4 is a terminal arranged on the side surface 21 of the package of the card module 2. As shown in FIG. The rest of the configuration is the same as the conventional one, so the explanation will be omitted.

With such a structure, the terminal 4 interlocks with other semiconductor devices and electrical/electronic components inside or outside the semiconductor card body.

Here, a terminal 4 is provided on the side surface 21 of the package of the semiconductor card module 2, and the location where this terminal is connected to the terminal on the card side is between the card and the module package side @21. Although shown, the connection location may be inside the semiconductor card body 1.

In addition, as shown in Figure 2, the terminal 4 is made longer and the card body 1 is
It can also be connected internally.

Furthermore, as shown in Figure 3, terminal 4 is connected to card module 2.
It may be provided on the top surface of the package, or, although not shown, it may be provided on the bottom surface of the package. [Effects of the Invention] As described above, according to the present invention, the Since it can be easily connected to other semiconductor devices and electrical/electronic parts inside or outside the card, the functions of the semiconductor card can be greatly increased.

[Brief explanation of drawings]

FIG. 1 is a perspective view and a side view showing one embodiment of the present invention, FIGS. 2 and 3 are a perspective view and a side view showing another embodiment of the invention, and FIG. and the fifth
The figures all show a conventional semiconductor card of this type, with FIG. 4 being a plan view and a side view, and FIG. 5 being an enlarged perspective view of the main parts. In the figure, 1 is the IC card body, 2 is the tC module 1, 3
is an external electrode, and 4 is a terminal. Note that the same reference numerals in the figures indicate the same or corresponding parts. Fig. 1 1: JF base body h-do body 2: 1000 + 1 tree n- domojienoshi δ: 2P Kanoya 1 se 4: jI&-) Fig. 2 (Re J Fig. 3 (b) J

Claims (3)

[Claims] (1) A semiconductor card comprising a semiconductor card module having a terminal disposed within the semiconductor card body and connected to another electrical component. (2) The semiconductor card according to claim 1, wherein the terminal is arranged on the side surface of the package of the semiconductor card module. (3) The semiconductor card according to claim 1, wherein the terminal is arranged on the top or bottom surface of the package of the semiconductor card module.