JPS6330375B2 - - Google Patents
Info
- Publication number
- JPS6330375B2 JPS6330375B2 JP60193407A JP19340785A JPS6330375B2 JP S6330375 B2 JPS6330375 B2 JP S6330375B2 JP 60193407 A JP60193407 A JP 60193407A JP 19340785 A JP19340785 A JP 19340785A JP S6330375 B2 JPS6330375 B2 JP S6330375B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- lead frame
- alloys
- good
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 description 23
- 239000000956 alloy Substances 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- -1 %Co Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60193407A JPS6254048A (ja) | 1985-09-02 | 1985-09-02 | リ−ドフレ−ム用銅合金 |
| US06/899,397 US4732733A (en) | 1985-09-02 | 1986-08-22 | Copper-base alloys for leadframes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60193407A JPS6254048A (ja) | 1985-09-02 | 1985-09-02 | リ−ドフレ−ム用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6254048A JPS6254048A (ja) | 1987-03-09 |
| JPS6330375B2 true JPS6330375B2 (fr) | 1988-06-17 |
Family
ID=16307442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60193407A Granted JPS6254048A (ja) | 1985-09-02 | 1985-09-02 | リ−ドフレ−ム用銅合金 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4732733A (fr) |
| JP (1) | JPS6254048A (fr) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2511289B2 (ja) * | 1988-03-30 | 1996-06-26 | 株式会社日立製作所 | 半導体装置 |
| JPH0330341A (ja) * | 1989-06-28 | 1991-02-08 | Mitsubishi Electric Corp | 半導体装置の製造方法及びその装置 |
| JP2904372B2 (ja) * | 1991-10-08 | 1999-06-14 | 恒昭 三川 | 時効硬化性特殊銅合金 |
| US5463247A (en) * | 1992-06-11 | 1995-10-31 | Mitsubishi Shindoh Co., Ltd. | Lead frame material formed of copper alloy for resin sealed type semiconductor devices |
| US5338374A (en) * | 1993-07-26 | 1994-08-16 | The United States Of America As Represented By The Secretary Of The Navy | Method of making copper-titanium nitride alloy |
| US5781379A (en) * | 1994-03-15 | 1998-07-14 | International Business Machines Corporation | Single beam flexure for a head gimbal assembly |
| US6351348B1 (en) | 1994-03-15 | 2002-02-26 | International Business Machines Corporation | Minimal stiffness conductors for a head gimbal assembly |
| US6282064B1 (en) | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
| US5955176A (en) * | 1994-03-15 | 1999-09-21 | International Business Machines Corporation | Integrated suspension using a high strength conductive material |
| US6539609B2 (en) | 1994-07-05 | 2003-04-01 | International Business Machines Corporation | Method of forming a head gimbal assembly |
| JPH0878605A (ja) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
| JP4549491B2 (ja) * | 2000-03-13 | 2010-09-22 | 大日本印刷株式会社 | 樹脂封止型半導体装置 |
| JP4568092B2 (ja) * | 2004-11-17 | 2010-10-27 | Ｄｏｗａホールディングス株式会社 | Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板 |
| WO2006080543A1 (fr) | 2005-01-28 | 2006-08-03 | Toyota Jidosha Kabushiki Kaisha | Structure de carrosserie automobile |
| CN103898353A (zh) * | 2014-04-02 | 2014-07-02 | 太原理工大学 | 一种高强度高导电性能铜合金及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834536B2 (ja) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | 半導体機器のリ−ド材用の銅合金 |
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
| US4612167A (en) * | 1984-03-02 | 1986-09-16 | Hitachi Metals, Ltd. | Copper-base alloys for leadframes |
-
1985
- 1985-09-02 JP JP60193407A patent/JPS6254048A/ja active Granted
-
1986
- 1986-08-22 US US06/899,397 patent/US4732733A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4732733A (en) | 1988-03-22 |
| JPS6254048A (ja) | 1987-03-09 |
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