JPS6329839B2 - - Google Patents
Info
- Publication number
- JPS6329839B2 JPS6329839B2 JP56112574A JP11257481A JPS6329839B2 JP S6329839 B2 JPS6329839 B2 JP S6329839B2 JP 56112574 A JP56112574 A JP 56112574A JP 11257481 A JP11257481 A JP 11257481A JP S6329839 B2 JPS6329839 B2 JP S6329839B2
- Authority
- JP
- Japan
- Prior art keywords
- shield plate
- legs
- substrate
- hole
- clamping part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 238000013459 approach Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Connection Of Plates (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257481A JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257481A JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5814600A JPS5814600A (ja) | 1983-01-27 |
| JPS6329839B2 true JPS6329839B2 (zh) | 1988-06-15 |
Family
ID=14590117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11257481A Granted JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814600A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0257072U (zh) * | 1988-10-19 | 1990-04-25 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3528749B2 (ja) | 2000-03-17 | 2004-05-24 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP2002267099A (ja) * | 2001-03-06 | 2002-09-18 | Taisei Corp | 低温タンク及び低温液の貯蔵方法 |
| JP2003110274A (ja) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | シールド構造を備えた電子機器 |
| JP3971994B2 (ja) * | 2002-12-19 | 2007-09-05 | 日本トムソン株式会社 | 保持器のずれ防止機構を備えた有限直動案内ユニット |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492362U (zh) * | 1977-12-13 | 1979-06-29 |
-
1981
- 1981-07-17 JP JP11257481A patent/JPS5814600A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0257072U (zh) * | 1988-10-19 | 1990-04-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5814600A (ja) | 1983-01-27 |
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