JPS63293179A - 銅を腐食から保護する方法 - Google Patents
銅を腐食から保護する方法Info
- Publication number
- JPS63293179A JPS63293179A JP63090476A JP9047688A JPS63293179A JP S63293179 A JPS63293179 A JP S63293179A JP 63090476 A JP63090476 A JP 63090476A JP 9047688 A JP9047688 A JP 9047688A JP S63293179 A JPS63293179 A JP S63293179A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- azole
- corrosion
- treatment
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 43
- 239000010949 copper Substances 0.000 title claims description 41
- 229910052802 copper Inorganic materials 0.000 title claims description 40
- 238000005260 corrosion Methods 0.000 title claims description 24
- 230000007797 corrosion Effects 0.000 title claims description 24
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 22
- 230000009257 reactivity Effects 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 36
- 238000011282 treatment Methods 0.000 description 24
- 239000000243 solution Substances 0.000 description 15
- 150000003851 azoles Chemical class 0.000 description 13
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 10
- 239000012964 benzotriazole Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 4
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- FDGQSTZJBFJUBT-UHFFFAOYSA-N hypoxanthine Chemical compound O=C1NC=NC2=C1NC=N2 FDGQSTZJBFJUBT-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- CSNIZNHTOVFARY-UHFFFAOYSA-N 1,2-benzothiazole Chemical compound C1=CC=C2C=NSC2=C1 CSNIZNHTOVFARY-UHFFFAOYSA-N 0.000 description 1
- YJJMBWKVCPBJDJ-UHFFFAOYSA-N 1,2-benzothiazole-3-thione Chemical compound C1=CC=C2C(=S)NSC2=C1 YJJMBWKVCPBJDJ-UHFFFAOYSA-N 0.000 description 1
- KTZQTRPPVKQPFO-UHFFFAOYSA-N 1,2-benzoxazole Chemical compound C1=CC=C2C=NOC2=C1 KTZQTRPPVKQPFO-UHFFFAOYSA-N 0.000 description 1
- VZDBJMCLRLLCTG-UHFFFAOYSA-N 1,2-benzoxazole-3-thione Chemical compound C1=CC=C2C(=S)NOC2=C1 VZDBJMCLRLLCTG-UHFFFAOYSA-N 0.000 description 1
- NNXMKFQFURUZQB-UHFFFAOYSA-N 1,2-thiazole-3-thione Chemical compound SC=1C=CSN=1 NNXMKFQFURUZQB-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- HEEACTTWORLLPM-UHFFFAOYSA-N 2-(1h-imidazol-5-yl)ethanol Chemical compound OCCC1=CNC=N1 HEEACTTWORLLPM-UHFFFAOYSA-N 0.000 description 1
- NAPDOWNULRULLI-UHFFFAOYSA-N 2-benzyl-1h-imidazole Chemical compound C=1C=CC=CC=1CC1=NC=CN1 NAPDOWNULRULLI-UHFFFAOYSA-N 0.000 description 1
- LDZYRENCLPUXAX-UHFFFAOYSA-N 2-methyl-1h-benzimidazole Chemical compound C1=CC=C2NC(C)=NC2=C1 LDZYRENCLPUXAX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- DWYHDSLIWMUSOO-UHFFFAOYSA-N 2-phenyl-1h-benzimidazole Chemical compound C1=CC=CC=C1C1=NC2=CC=CC=C2N1 DWYHDSLIWMUSOO-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 description 1
- CLEJZSNZYFJMKD-UHFFFAOYSA-N 3h-1,3-oxazole-2-thione Chemical compound SC1=NC=CO1 CLEJZSNZYFJMKD-UHFFFAOYSA-N 0.000 description 1
- OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical compound SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 description 1
- DLHAWERXBUJHNY-UHFFFAOYSA-N 4-benzyl-1h-pyrazole Chemical compound C=1C=CC=CC=1CC=1C=NNC=1 DLHAWERXBUJHNY-UHFFFAOYSA-N 0.000 description 1
- LJUQGASMPRMWIW-UHFFFAOYSA-N 5,6-dimethylbenzimidazole Chemical compound C1=C(C)C(C)=CC2=C1NC=N2 LJUQGASMPRMWIW-UHFFFAOYSA-N 0.000 description 1
- RWXZXCZBMQPOBF-UHFFFAOYSA-N 5-methyl-1H-benzimidazole Chemical compound CC1=CC=C2N=CNC2=C1 RWXZXCZBMQPOBF-UHFFFAOYSA-N 0.000 description 1
- PJCTVLGNVGGVJR-UHFFFAOYSA-N 5-prop-2-enyl-1h-imidazole Chemical compound C=CCC1=CN=CN1 PJCTVLGNVGGVJR-UHFFFAOYSA-N 0.000 description 1
- ORZRMRUXSPNQQL-UHFFFAOYSA-N 6-nitro-1h-indazole Chemical compound [O-][N+](=O)C1=CC=C2C=NNC2=C1 ORZRMRUXSPNQQL-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 description 1
- 229930024421 Adenine Natural products 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- UGQMRVRMYYASKQ-UHFFFAOYSA-N Hypoxanthine nucleoside Natural products OC1C(O)C(CO)OC1N1C(NC=NC2=O)=C2N=C1 UGQMRVRMYYASKQ-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229960000643 adenine Drugs 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- PXXJHWLDUBFPOL-UHFFFAOYSA-N benzamidine Chemical compound NC(=N)C1=CC=CC=C1 PXXJHWLDUBFPOL-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000013000 chemical inhibitor Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- -1 inoxazoles Chemical class 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000003854 isothiazoles Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000004867 thiadiazoles Chemical class 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229940075420 xanthine Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/052,337 US4731128A (en) | 1987-05-21 | 1987-05-21 | Protection of copper from corrosion |
| US52337 | 1987-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63293179A true JPS63293179A (ja) | 1988-11-30 |
| JPH0143837B2 JPH0143837B2 (enExample) | 1989-09-22 |
Family
ID=21976965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63090476A Granted JPS63293179A (ja) | 1987-05-21 | 1988-04-14 | 銅を腐食から保護する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4731128A (enExample) |
| EP (1) | EP0291743B1 (enExample) |
| JP (1) | JPS63293179A (enExample) |
| DE (1) | DE3873409T2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03124395A (ja) * | 1989-10-03 | 1991-05-27 | Hideyuki Kawai | はんだ付け用プレフラックス |
| JPH04206681A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 印刷配線板の表面処理方法及び印刷配線板 |
| KR101138538B1 (ko) | 2004-12-22 | 2012-04-25 | 재단법인 포항산업과학연구원 | 고로 노체 냉각반 모재의 부식 억제방법 |
| WO2019142791A1 (ja) * | 2018-01-17 | 2019-07-25 | 日立化成株式会社 | 接着剤組成物、接続構造体及びその製造方法 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873139A (en) * | 1988-03-29 | 1989-10-10 | Minnesota Mining And Manufacturing Company | Corrosion resistant silver and copper surfaces |
| EP0342669B1 (en) * | 1988-05-20 | 1995-08-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| EP0364132A1 (en) * | 1988-09-29 | 1990-04-18 | Shikoku Chemicals Corporation | Method for forming conversion coating on surface of copper or copper alloy |
| KR960008153B1 (ko) * | 1989-10-03 | 1996-06-20 | 다찌바나 다이끼찌 | 금속 공작용 표면 처리제 |
| US5173130A (en) * | 1989-11-13 | 1992-12-22 | Shikoku Chemicals Corporation | Process for surface treatment of copper and copper alloy |
| US5075965A (en) * | 1990-11-05 | 1991-12-31 | International Business Machines | Low temperature controlled collapse chip attach process |
| DE4039271A1 (de) * | 1990-12-08 | 1992-06-11 | Basf Ag | Verfahren zum schutz von kupfer- und kupferlegierungsoberlfaechen vor korrosion |
| US5478607A (en) * | 1991-05-17 | 1995-12-26 | Hitachi Telecon Technologies Ltd. | Method for use of preflux, printed wiring board, and method for production thereof |
| DE4311807C2 (de) * | 1993-04-03 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik |
| DE4339019A1 (de) * | 1993-11-10 | 1995-05-11 | Atotech Deutschland Gmbh | Verfahren zur Herstellung von Leiterplatten |
| AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
| US5686676A (en) * | 1996-05-07 | 1997-11-11 | Brush Wellman Inc. | Process for making improved copper/tungsten composites |
| US6322904B1 (en) * | 1996-06-17 | 2001-11-27 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed circuit boards |
| US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
| US6524644B1 (en) * | 1999-08-26 | 2003-02-25 | Enthone Inc. | Process for selective deposition of OSP coating on copper, excluding deposition on gold |
| CN1681373A (zh) * | 2001-08-10 | 2005-10-12 | 日矿金属加工株式会社 | 层叠板用铜合金箔 |
| US7456105B1 (en) * | 2002-12-17 | 2008-11-25 | Amd, Inc. | CMP metal polishing slurry and process with reduced solids concentration |
| US20070221503A1 (en) * | 2006-03-22 | 2007-09-27 | Brian Larson | Precoat composition for organic solderability preservative |
| US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
| US20170183783A1 (en) | 2015-12-29 | 2017-06-29 | Rohm And Haas Electronic Materials Llc | Method for forming organic coating on copper surface |
| JP7017612B1 (ja) * | 2020-08-13 | 2022-02-08 | トヨタ自動車株式会社 | 冷却液組成物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB933979A (en) * | 1961-04-27 | 1963-08-14 | Ici Ltd | Improvements in or relating to inhibiting corrosion of copper and copper-base alloys |
| GB1065997A (en) * | 1964-01-24 | 1967-04-19 | Geigy Uk Ltd | Corrosion preventing treatment |
| GB1081282A (en) * | 1964-08-14 | 1967-08-31 | Geigy Uk Ltd | Bis-benzotriazoles and compositions containing same |
| DE2116012C3 (de) * | 1970-04-02 | 1973-11-15 | Shikoku Kasei Kogyo Co. Ltd., Marugame, Kagawa (Japan) | Verwendung von Imidazoldenvaten als Auftragmittel zur Oberflachenbehandlung eines ohne Flußmittel zu lotenden Metalles |
| US3716421A (en) * | 1971-03-19 | 1973-02-13 | Gte Sylvania Inc | Compositions for improved solderability of copper |
| US3998993A (en) * | 1975-06-09 | 1976-12-21 | Bell Telephone Laboratories, Incorporated | Electrical device having a metal surface bearing a corrosion inhibitor |
| US4373656A (en) * | 1981-07-17 | 1983-02-15 | Western Electric Company, Inc. | Method of preserving the solderability of copper |
| GB2104017B (en) * | 1981-08-12 | 1984-09-26 | Brylite Batteries Limited | Motorised golf trolley |
| US4395294A (en) * | 1981-08-17 | 1983-07-26 | Bell Telephone Laboratories, Incorporated | Copper corrosion inhibitor |
-
1987
- 1987-05-21 US US07/052,337 patent/US4731128A/en not_active Expired - Fee Related
-
1988
- 1988-04-14 JP JP63090476A patent/JPS63293179A/ja active Granted
- 1988-04-28 DE DE8888106835T patent/DE3873409T2/de not_active Expired - Fee Related
- 1988-04-28 EP EP88106835A patent/EP0291743B1/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03124395A (ja) * | 1989-10-03 | 1991-05-27 | Hideyuki Kawai | はんだ付け用プレフラックス |
| JPH04206681A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 印刷配線板の表面処理方法及び印刷配線板 |
| KR101138538B1 (ko) | 2004-12-22 | 2012-04-25 | 재단법인 포항산업과학연구원 | 고로 노체 냉각반 모재의 부식 억제방법 |
| WO2019142791A1 (ja) * | 2018-01-17 | 2019-07-25 | 日立化成株式会社 | 接着剤組成物、接続構造体及びその製造方法 |
| KR20200108439A (ko) * | 2018-01-17 | 2020-09-18 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 접속 구조체 및 그의 제조 방법 |
| JPWO2019142791A1 (ja) * | 2018-01-17 | 2021-01-28 | 昭和電工マテリアルズ株式会社 | 接着剤組成物、接続構造体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3873409T2 (de) | 1993-03-18 |
| EP0291743A1 (en) | 1988-11-23 |
| DE3873409D1 (de) | 1992-09-10 |
| US4731128A (en) | 1988-03-15 |
| JPH0143837B2 (enExample) | 1989-09-22 |
| EP0291743B1 (en) | 1992-08-05 |
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