JPS63288795A - Manufacture of ic card - Google Patents
Manufacture of ic cardInfo
- Publication number
- JPS63288795A JPS63288795A JP62125217A JP12521787A JPS63288795A JP S63288795 A JPS63288795 A JP S63288795A JP 62125217 A JP62125217 A JP 62125217A JP 12521787 A JP12521787 A JP 12521787A JP S63288795 A JPS63288795 A JP S63288795A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- card
- terminal piece
- layer
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＩＣカードの製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an IC card.
ＩＣチップを名刺大のカードに組込んだＩＣカードはそ
の構成上、外部回路との接続用端子を必要とする。An IC card in which an IC chip is incorporated into a business card-sized card requires a terminal for connection to an external circuit due to its structure.
第４図は従来のＩＣカードの突起電極を説明するための
印刷配線基板の断面図である。FIG. 4 is a sectional view of a printed wiring board for explaining the protruding electrodes of a conventional IC card.
第４図に示すように、絶縁基板１の上に配線層１０を選
択的に設け、表面にホトレジストＩＪｉｌｌを形成した
後、配線層１０の所定位置に選択的に開口部を設ける。As shown in FIG. 4, after a wiring layer 10 is selectively provided on the insulating substrate 1 and a photoresist IJill is formed on the surface, openings are selectively provided at predetermined positions in the wiring layer 10.
次に、前記開口部の配線層１０の表面に電気めっき法に
より金属を堆積させ突起電極１２を形成する。そのとき
、めっき電流が端部に集中し易く突起電極の上面中央に
凹部１３ができ易い。Next, a protruding electrode 12 is formed by depositing metal on the surface of the wiring layer 10 in the opening by electroplating. At this time, the plating current tends to concentrate at the ends, and a recess 13 is likely to be formed at the center of the upper surface of the protruding electrode.
上述した従来のＩＣカードの製造方法は、電気めっき法
で形成した突起電極の上面中央に凹部ができるため、Ｉ
Ｃカードを外部回路に接続して動作させようとするとき
に、外部回路の接触子とＩＣカードの突起電極との間の
接触が不十分となり接続不良を起すという問題点がある
。In the conventional IC card manufacturing method described above, a recess is formed in the center of the upper surface of the protruding electrode formed by electroplating, so
When attempting to operate the C card by connecting it to an external circuit, there is a problem in that the contact between the contacts of the external circuit and the protruding electrodes of the IC card is insufficient, resulting in a connection failure.
また、突起電極を電気めっき法により形成しているため
、工程時間が長くなるという問題点かある。Furthermore, since the protruding electrodes are formed by electroplating, there is a problem in that the process takes a long time.
本発明のＩＣカードの製造方法は、絶縁基板上の所定位
置に端子片を固定する工程と、前記端子片を含む絶縁基
板全面に無電解めっき層を形成し選択的にエツチングし
て前記端子片を被覆し前記絶縁基板上に延在する配線パ
ターンを形成する工程と、前記配線パターン上に金属層
を電気めっきする工程とを含んで構成される。The method for manufacturing an IC card of the present invention includes the steps of fixing a terminal piece at a predetermined position on an insulating substrate, forming an electroless plating layer on the entire surface of the insulating substrate including the terminal piece, and selectively etching the terminal piece. The method includes the steps of forming a wiring pattern covering the insulating substrate and extending on the insulating substrate, and electroplating a metal layer on the wiring pattern.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例を説明するための印刷配
線基板の断面図である。FIG. 1 is a sectional view of a printed wiring board for explaining a first embodiment of the present invention.
第１図に示すように、ガラス繊維入りエポキシ樹脂又は
トリアジン系樹脂等の絶縁基板１の上の所定の位置にニ
ッケル又は４２合金等の金属あるいはエポキシ又はトリ
アジン等の樹脂からなる端子片２をエポキシ系接着剤３
を用いて固定する。As shown in Figure 1, a terminal piece 2 made of metal such as nickel or 42 alloy, or resin such as epoxy or triazine is attached to a predetermined position on an insulating substrate 1 made of glass fiber-containing epoxy resin or triazine resin. Adhesive 3
Fix it using.
次に端子片２を含む絶縁基板１の表面に無電解銅めっき
層４を設けた後１、選択的にエツチングして端子片２を
含み絶縁基板１の上に延在する配線パターンを形成する
０次に、前記配線パターンを有する銅めっき層４の上に
電気めっき法により、膜厚１５μｍの銅ＮＩ５、膜厚７
μｍのニッケル層６、膜厚１μｍの金層７を順次積層し
て突起電極を形成する。Next, an electroless copper plating layer 4 is provided on the surface of the insulating substrate 1 including the terminal pieces 2, and then selectively etched to form a wiring pattern including the terminal pieces 2 and extending on the insulating substrate 1. Next, on the copper plating layer 4 having the wiring pattern, copper NI5 with a film thickness of 15 μm and a film with a film thickness of 7 μm are deposited by electroplating.
A protruding electrode is formed by sequentially laminating a nickel layer 6 with a thickness of 1 μm and a gold layer 7 with a thickness of 1 μm.
第２図は本発明の第２の実施例を説明するための印刷配
線基板の断面図である。FIG. 2 is a sectional view of a printed wiring board for explaining a second embodiment of the present invention.
第２図に示すように、絶縁基板１の所定位置に選択的に
開口部を設け、底面中央に突起部を有する端子片８の前
記突起部を前記開口部に挿入して接着剤３により固定す
る。以下の工程は第１の実施例と同じである。As shown in FIG. 2, an opening is selectively provided at a predetermined position of the insulating substrate 1, and the protrusion of the terminal piece 8 having a protrusion at the center of the bottom surface is inserted into the opening and fixed with adhesive 3. do. The following steps are the same as in the first embodiment.
第３図は本発明の第３の実施例を説明するための印刷配
線基板の断面図である。FIG. 3 is a sectional view of a printed wiring board for explaining a third embodiment of the present invention.
第３図に示すように、絶縁基板１の所定位置に選択的に
開口部を設け、底面中央に前記絶縁基板１の厚さよりも
長い突起部を有する端子片９の前記突起部を前記開口部
に挿入して前記突起部をかしめて端子片９を固定する。As shown in FIG. 3, an opening is selectively provided at a predetermined position of the insulating substrate 1, and the protrusion of the terminal piece 9, which has a protrusion longer than the thickness of the insulating substrate 1 at the center of the bottom surface, is inserted into the opening. The terminal piece 9 is fixed by inserting the terminal piece 9 into the terminal and caulking the protrusion.
以下の工程は第１の実施例と同じである。The following steps are the same as in the first embodiment.
第２及び第３の実施例では端子片８．９が正確な位置に
取付けられ且つ取付強度が大きいという効果がある。The second and third embodiments have the advantage that the terminal pieces 8.9 can be attached to accurate positions and the attachment strength is high.
以上説明したように本発明は、絶縁基板上の所定位置に
固定した端子片を被覆する無電解めっき層を設けて選択
的にエツチングし、前記端子片を含む配線パターンを形
成し、配線パターンに電気めっきで金属層を積層して突
起電極を形成することにより、突起電極の上面を平坦化
し、外部回路の接触子との接続を確実なものとするとい
う効果を有する。As explained above, the present invention provides an electroless plating layer covering a terminal piece fixed at a predetermined position on an insulating substrate and selectively etches it to form a wiring pattern including the terminal piece. Forming a protruding electrode by laminating metal layers by electroplating has the effect of flattening the upper surface of the protruding electrode and ensuring reliable connection with a contact of an external circuit.
また、絶縁基板の所定位置に開口部を設け、底面に突起
部を有する端子片の突起部を開口部に挿入して固定する
ことにより、突起電極の取付精度と取付強度を更に向上
させるという効果を有する。In addition, by providing an opening at a predetermined position on the insulating substrate and inserting and fixing the protrusion of the terminal piece having a protrusion on the bottom into the opening, the mounting accuracy and mounting strength of the protruding electrode can be further improved. has.
第１図乃至第３図は本発明の第１乃至第３の実施例を説
明するための印刷配線基板の断面図、第４図は従来のＩ
Ｃカードの突起電極を説明するための印刷配線基板の断
面図である。
１・・・絶縁基板、２・・・端子片、３・・・接着剤、
４・・・無電解銅めっき層、５・・・銅層、６・・・ニ
ッケル層、７・・・金層、８．９・・・端子片、１０・
・・配線層、１１゜・・・ホトレジスト膜、１２・・・
突起電極、１３・・・凹部。
代理人 弁理士 内 原 晋（’ｒｙ’（パ・・・1 to 3 are cross-sectional views of a printed wiring board for explaining the first to third embodiments of the present invention, and FIG. 4 is a sectional view of a conventional printed wiring board.
FIG. 3 is a cross-sectional view of a printed wiring board for explaining protruding electrodes of a C card. 1... Insulating board, 2... Terminal piece, 3... Adhesive,
4... Electroless copper plating layer, 5... Copper layer, 6... Nickel layer, 7... Gold layer, 8.9... Terminal piece, 10...
...Wiring layer, 11°...Photoresist film, 12...
Protruding electrode, 13... recess. Agent Patent Attorney Susumu Uchihara ('ry')
Claims (1)
記端子片を含む絶縁基板全面に無電解めっき層を形成し
選択的にエッチングして前記端子片を被覆し前記絶縁基
板上に延在する配線パターンを形成する工程と、前記配
線パターン上に金属層を電気めっきする工程とを含むこ
とを特徴とするＩＣカードの製造方法。A step of fixing a terminal piece at a predetermined position on an insulating substrate, and forming an electroless plating layer on the entire surface of the insulating substrate including the terminal piece and selectively etching it to cover the terminal piece and extending it on the insulating substrate. A method for manufacturing an IC card, comprising the steps of: forming a wiring pattern; and electroplating a metal layer on the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125217A JPH0657478B2 (en) | 1987-05-21 | 1987-05-21 | Method of manufacturing IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125217A JPH0657478B2 (en) | 1987-05-21 | 1987-05-21 | Method of manufacturing IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63288795A true JPS63288795A (en) | 1988-11-25 |
| JPH0657478B2 JPH0657478B2 (en) | 1994-08-03 |
Family
ID=14904761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125217A Expired - Lifetime JPH0657478B2 (en) | 1987-05-21 | 1987-05-21 | Method of manufacturing IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657478B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03291991A (en) * | 1990-04-09 | 1991-12-24 | Fujitsu Ltd | Forming method for pad |
| JP2005071144A (en) * | 2003-08-26 | 2005-03-17 | Toppan Printing Co Ltd | Antenna coil for ic tag and manufacturing method thereof |
| US12083623B2 (en) | 2013-06-09 | 2024-09-10 | Apple Inc. | Laser-formed features |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62112394A (en) * | 1985-11-11 | 1987-05-23 | イビデン株式会社 | Printed wiring board for ic card |
-
1987
- 1987-05-21 JP JP62125217A patent/JPH0657478B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62112394A (en) * | 1985-11-11 | 1987-05-23 | イビデン株式会社 | Printed wiring board for ic card |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03291991A (en) * | 1990-04-09 | 1991-12-24 | Fujitsu Ltd | Forming method for pad |
| JP2005071144A (en) * | 2003-08-26 | 2005-03-17 | Toppan Printing Co Ltd | Antenna coil for ic tag and manufacturing method thereof |
| US12083623B2 (en) | 2013-06-09 | 2024-09-10 | Apple Inc. | Laser-formed features |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0657478B2 (en) | 1994-08-03 |
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