JPS6328531Y2 - - Google Patents
Info
- Publication number
- JPS6328531Y2 JPS6328531Y2 JP1981065382U JP6538281U JPS6328531Y2 JP S6328531 Y2 JPS6328531 Y2 JP S6328531Y2 JP 1981065382 U JP1981065382 U JP 1981065382U JP 6538281 U JP6538281 U JP 6538281U JP S6328531 Y2 JPS6328531 Y2 JP S6328531Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- adhesive
- connecting member
- elastomer connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981065382U JPS6328531Y2 (enExample) | 1981-05-06 | 1981-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981065382U JPS6328531Y2 (enExample) | 1981-05-06 | 1981-05-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57178380U JPS57178380U (enExample) | 1982-11-11 |
| JPS6328531Y2 true JPS6328531Y2 (enExample) | 1988-08-01 |
Family
ID=29861424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981065382U Expired JPS6328531Y2 (enExample) | 1981-05-06 | 1981-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6328531Y2 (enExample) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5625753B2 (enExample) * | 1974-01-21 | 1981-06-15 | ||
| JPS5144291A (en) * | 1974-10-14 | 1976-04-15 | Oki Electric Ind Co Ltd | Furekishiburu kontakuto |
| JPS5115681A (en) * | 1974-07-31 | 1976-02-07 | Ohtake Noodle Mach Mfg | Mensenno bunri saibunkatsusochi |
| JPS583343B2 (ja) * | 1976-06-14 | 1983-01-20 | 信越ポリマ−株式会社 | インタ−コネクタ− |
| JPS53147991A (en) * | 1977-05-31 | 1978-12-23 | Shinetsu Polymer Co | Pressure contact holding type nonnisotropic conductive elastomer connector |
| JPS5485388A (en) * | 1977-12-20 | 1979-07-06 | Shinetsu Polymer Co | Connection method of circuit and interconnector used for same |
-
1981
- 1981-05-06 JP JP1981065382U patent/JPS6328531Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57178380U (enExample) | 1982-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5168432A (en) | Adapter for connection of an integrated circuit package to a circuit board | |
| JP3863213B2 (ja) | 半導体装置 | |
| US5736780A (en) | Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes | |
| EP0660383B1 (en) | Electronic device package | |
| US6744122B1 (en) | Semiconductor device, method of manufacture thereof, circuit board, and electronic device | |
| EP0187195B1 (en) | Method of manufacturing a circuit module | |
| EP0213575B1 (en) | Method of manufacturing a semiconductor device employing a film carrier tape | |
| JP2987101B2 (ja) | 半導体装置の接続方法並びに半導体装置の接続器 | |
| KR940006185Y1 (ko) | Ic 모듈 | |
| EP0778617A2 (en) | Electronic device package enclosed by pliant medium laterally confined by a plastic rim member | |
| US5391916A (en) | Resin sealed type semiconductor device | |
| US6642730B1 (en) | Test carrier with molded interconnect for testing semiconductor components | |
| US4643499A (en) | Component mounting apparatus | |
| KR100546364B1 (ko) | 유연성 필름을 이용한 반도체 패키지 및 그 제조방법 | |
| US4126882A (en) | Package for multielement electro-optical devices | |
| JPS6328531Y2 (enExample) | ||
| US6208022B1 (en) | Electronic-circuit assembly | |
| KR20010014797A (ko) | 반도체장치 및 그 제조방법 | |
| JP4081309B2 (ja) | 電子部品用ソケット及びその製造方法並びに電子部品用ソケットを用いた実装構造 | |
| JP3080106B2 (ja) | Icモジュールの接続方法 | |
| JPH0521701A (ja) | 混成集積回路装置 | |
| JPS6279638A (ja) | 絶縁材料製の枠の開放部内に懸架されたicを基板上に取付ける方法 | |
| JPH0340458A (ja) | 半導体装置およびその製造方法 | |
| KR19990030098A (ko) | 사전 동작 시험 장치 | |
| JPH079138Y2 (ja) | 液晶表示板の配線パタ−ンの構造 |