JPS63278356A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS63278356A
JPS63278356A JP11521287A JP11521287A JPS63278356A JP S63278356 A JPS63278356 A JP S63278356A JP 11521287 A JP11521287 A JP 11521287A JP 11521287 A JP11521287 A JP 11521287A JP S63278356 A JPS63278356 A JP S63278356A
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip
leads
resin
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11521287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570305B2 (enrdf_load_stackoverflow
Inventor
Takashi Kusakari
草刈　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11521287A priority Critical patent/JPS63278356A/ja
Publication of JPS63278356A publication Critical patent/JPS63278356A/ja
Publication of JPH0570305B2 publication Critical patent/JPH0570305B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11521287A 1987-05-11 1987-05-11 半導体集積回路 Granted JPS63278356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11521287A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11521287A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS63278356A true JPS63278356A (ja) 1988-11-16
JPH0570305B2 JPH0570305B2 (enrdf_load_stackoverflow) 1993-10-04

Family

ID=14657140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11521287A Granted JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS63278356A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109256A (ja) * 1983-11-18 1985-06-14 Oki Electric Ind Co Ltd プラスチツク型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109256A (ja) * 1983-11-18 1985-06-14 Oki Electric Ind Co Ltd プラスチツク型半導体装置

Also Published As

Publication number Publication date
JPH0570305B2 (enrdf_load_stackoverflow) 1993-10-04

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