JPS63272092A - 超強力複合レ−ザ・ビ−ム造出法 - Google Patents

超強力複合レ−ザ・ビ−ム造出法

Info

Publication number
JPS63272092A
JPS63272092A JP62107675A JP10767587A JPS63272092A JP S63272092 A JPS63272092 A JP S63272092A JP 62107675 A JP62107675 A JP 62107675A JP 10767587 A JP10767587 A JP 10767587A JP S63272092 A JPS63272092 A JP S63272092A
Authority
JP
Japan
Prior art keywords
beams
parallel
composite
laser
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62107675A
Other languages
English (en)
Inventor
Yoshiaki Arata
吉明 荒田
Tatsuharu Oda
小田　辰春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP62107675A priority Critical patent/JPS63272092A/ja
Priority to US07/109,567 priority patent/US4828357A/en
Publication of JPS63272092A publication Critical patent/JPS63272092A/ja
Priority to US07/271,270 priority patent/US4953950A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
    • G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/12—Beam splitting or combining systems operating by refraction only
    • G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/143—Beam splitting or combining systems operating by reflection only using macroscopically faceted or segmented reflective surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 複数個の同一外形をもつ丸棒の最も安定な「束ね」方法
としては、３木が相互に接するように束ねるのが最も良
いとされている。これはその断面配置分布が正三角配置
となっており、最も稠密度の高い「最小単位」の配置を
しているからである。レーザビームの場合も、３本のビ
ームがともに上記の例と同じ配置をとると、最も稠密度
の高い「複合レーザビーム」となる、このことについて
、もう少し詳しく次に説明する。
図１はその概念図であって、レーザ発振器＃ｌより＃ｌ
ビームが直進している。この＃ｌビームに接するように
して円形の平面レーザミラーのをほぼ４５＠になるよう
に置き、レーザ発振器＃２より直進してきたレーザビー
ムをこのミラー＠にて９０°方向変換し、その角度を精
密に調整し。
＃１ビーム、＃２ビームがほぼ平行に接する２本のビー
ムを「平行束」にする、このようにして出来た「平行束
」ビームに接するように、「レーザ発振器」＃３より出
た＃３ビームをミラー［相］で方向変換し、「平行束」
ビームにほぼ接した状態で平行に３本ビームの「平行束
」を作る０図１（ａ）に示すように、これによって最も
稠密度の高い「最小単位」の配置をとることができる。
このようにして３本以上の複数本ビームの「平行束」を
作ることが出来るが、特に図ｉ　（ｂ）にように７本ビ
ームの「平行束」を作ることが出来る。この「平行束」
は３本ビームの「平行束」と同様量も稠密度の高い「複
合ビーム」となる８次の最稠密度分布数は１９木の「平
行束」である。
このようにしていくらでも多数の「平行束」が得られる
。
このような稠密な「平行束」をそれぞれ図２に示す手段
でその外径を縮小し、高エネルギ密度「平行束」とする
、この「平行束」を１本の「合ビーム」と考え、その複
数「合ビーム」をさらに図１の方法あるいは図３の方法
によって複合化。
し、さらに強力な１本の稠密度化されたｒ合手行末」を
作ることが出来る０図３は２本「合ビーム」による「合
手行末」造出の複合化システムを示す０図４（Ａ）は３
本「合ビーム」によるｒ合手行末」のビーム断面図であ
る０図４（Ｂ）は４本「合ビーム」の「合手行末」のビ
ーム断面図である０図４（Ｃ）は５本「合ビーム」の場
合を示している。
これら複数１合ビーム」による「合手行末」はすべて図
３の「特殊ミラー」で集光される。
このミラーからある距離離れた位置に対しては、ｉｌｌ
ｌｌボーれに対応する「所定角度」になると、ｒ合手行
末」の全ビームがその位置に収束し、強力なエネルギと
密度が集中する。たとえば１図４（Ａ）に対しては図４
（Ｄ）にように収束し１図４（Ｂ）の場合には図４（Ｅ
）のようになり、中心近傍が最も高エネルギ密度状態の
超強力「複合ビーム」となる。
４、図の簡単な説明 図１はレーザビームの「平行束」を造出する装置の概念
図である。
■レーザビームを発生する１番目の「発振器＃１」 ■レーザビームを発生する２番目の「発振器＃２」 ■レーザビームを発生する３番目の「発振器＃３」 ■「発信器＃２」より直進するレーザビームを方向変換
するミラー ■「発信器＃３」より直進するレーザビームを方向変換
するミラー ■「発信器＃ｌ」より直進する＃ル−ザビーム ■同上ビームの断面 ■「発信器＃２」より直進する＃２レーザビーム ■＃ｌ、＃２ビームによる２本の「平行束」の断面 ■［発信器＃３］より直進する＃３レーザビーム ■＄ｔ１．＃２、＃３ビームによる３木の「平行束」の
断面 （ａ）３本ビームの「平行束」の断面 （ｂ）７本ビームの「平行束」の断面 図２はレーザビームの外縁外径を縮小し高エネルギ密度
の複合平行ビームとする手段の説明図である。
■レーザビームの「平行束」 ■「平行束」を収束する凹面鏡 ■収束後再度拡散の途中で外縁外径の縮小された平行ビ
ームとする凹面鏡 ■高エネルギ密度化された１合ビーム」図３は「合ビー
ム」または「平行束」を２本を合せて「合手行末」とす
るための複合化システムを示している。以下ｒ全ビーム
」として説明する。
■＃１「合ビーム」を造出する発生器 ■＃２「合ビーム」を造出する発生器 ■＃ｌ「合ビーム」の断面 ■＃２「合ビーム」の断面 ■＃１「合ビーム」の方向を９０”変換する特殊ミラー ■＃２「合ビーム」の方向を９０°変換する特殊ミラー ■２木の１合ビーム」による「合手行末」図４は複数本
ビームの「平行束」あるいは１合ビーム」による「合手
行末」のビーム断面図である。以下「合ビーム」として
説明する。
（Ａ）３木の「合ビーム」による「合手行末」の断面 （Ｂ）４木の「合ビーム」によるｒ合手行末」の断面 （Ｃ）５木の１合ビーム」による「合手行末」の断面 （Ｄ）３木の「合ビーム」の各々のセンターが一点に集
中するように収束した場合のビーム断面 （Ｅ）４木の１合ビーム」の各々のセンターが一点に集
中するように収束した場合のビーム断面

Claims (1)

    【特許請求の範囲】
  1. 本特許はレーザビームを大出力化・高エネルギ密度化す
    る場合のビームの複合方法に関するものである。一般に
    レーザビーム断面形状は円形のものが多いが、この円形
    断面をもつ複数本のレーザビームが、それぞれ平行して
    隣接するように配置することによって平行複合ビームを
    作り、その外縁外径を縮小する手段を用い、該ビームを
    高エネルギ密度の縮小平行複合ビームとし、これを一本
    の「合ビーム」と考え、その複数本の所定の組合せによ
    って、ビーム数の「稠密度」を極めて高くし、大出力ビ
    ーム化することを特徴とした超強力「複合レーザビーム
    」造出方法。
JP62107675A 1987-04-30 1987-04-30 超強力複合レ−ザ・ビ−ム造出法 Pending JPS63272092A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62107675A JPS63272092A (ja) 1987-04-30 1987-04-30 超強力複合レ−ザ・ビ−ム造出法
US07/109,567 US4828357A (en) 1987-04-30 1987-10-19 Apparatus for producing ultra-high power, ultra-high density laser beam
US07/271,270 US4953950A (en) 1987-04-30 1988-11-15 Apparatus for producing ultra-high power ultra-high density laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62107675A JPS63272092A (ja) 1987-04-30 1987-04-30 超強力複合レ−ザ・ビ−ム造出法

Publications (1)

Publication Number Publication Date
JPS63272092A true JPS63272092A (ja) 1988-11-09

Family

ID=14465138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62107675A Pending JPS63272092A (ja) 1987-04-30 1987-04-30 超強力複合レ−ザ・ビ−ム造出法

Country Status (2)

Country Link
US (2) US4828357A (ja)
JP (1) JPS63272092A (ja)

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