JPS6326545B2 - - Google Patents
Info
- Publication number
- JPS6326545B2 JPS6326545B2 JP10894779A JP10894779A JPS6326545B2 JP S6326545 B2 JPS6326545 B2 JP S6326545B2 JP 10894779 A JP10894779 A JP 10894779A JP 10894779 A JP10894779 A JP 10894779A JP S6326545 B2 JPS6326545 B2 JP S6326545B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- container
- lid member
- cover member
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894779A JPS5632749A (en) | 1979-08-27 | 1979-08-27 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894779A JPS5632749A (en) | 1979-08-27 | 1979-08-27 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5632749A JPS5632749A (en) | 1981-04-02 |
| JPS6326545B2 true JPS6326545B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-30 |
Family
ID=14497671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10894779A Granted JPS5632749A (en) | 1979-08-27 | 1979-08-27 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5632749A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5215458A (en) * | 1988-03-04 | 1993-06-01 | Bic Corporation | Child-resistant lighter with spring-biased, rotatable safety release |
| JPH03501647A (ja) * | 1988-07-01 | 1991-04-11 | スィブジェ ソシエテ アノニム | 安全ライター |
| US5445518A (en) * | 1988-09-02 | 1995-08-29 | Bic Corporation | Selectively actuatable lighter |
| US5456598A (en) * | 1988-09-02 | 1995-10-10 | Bic Corporation | Selectively actuatable lighter |
| US5002482B1 (en) * | 1988-09-02 | 2000-02-29 | Bic Corp | Selectively actuatable lighter |
| FR2705762B1 (fr) * | 1993-05-28 | 1995-08-18 | Hameur Cie | Sécurité de briquet. |
| US5558514A (en) * | 1994-05-27 | 1996-09-24 | Hameur Et Cie | Safety latch for a lighter |
-
1979
- 1979-08-27 JP JP10894779A patent/JPS5632749A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5632749A (en) | 1981-04-02 |