JPS6326508A - 実装部品検査装置 - Google Patents
実装部品検査装置Info
- Publication number
- JPS6326508A JPS6326508A JP61169033A JP16903386A JPS6326508A JP S6326508 A JPS6326508 A JP S6326508A JP 61169033 A JP61169033 A JP 61169033A JP 16903386 A JP16903386 A JP 16903386A JP S6326508 A JPS6326508 A JP S6326508A
- Authority
- JP
- Japan
- Prior art keywords
- light
- height
- data
- brightness
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims description 14
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims description 14
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61169033A JPS6326508A (ja) | 1986-07-19 | 1986-07-19 | 実装部品検査装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61169033A JPS6326508A (ja) | 1986-07-19 | 1986-07-19 | 実装部品検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6326508A true JPS6326508A (ja) | 1988-02-04 |
JPH0367567B2 JPH0367567B2 (ko) | 1991-10-23 |
Family
ID=15879073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61169033A Granted JPS6326508A (ja) | 1986-07-19 | 1986-07-19 | 実装部品検査装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6326508A (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005335712A (ja) * | 2004-05-24 | 2005-12-08 | Chuoh Pack Industry Co Ltd | ワイヤレス段ボールケース |
JP2007317972A (ja) * | 2006-05-29 | 2007-12-06 | Hitachi High-Technologies Corp | 電子部品の貼付状態検査装置 |
CN103471511A (zh) * | 2013-09-23 | 2013-12-25 | 马晓璐 | 一种包裹尺寸测量仪 |
US11777228B2 (en) * | 2019-12-09 | 2023-10-03 | Nxp Usa, Inc. | Multi-polarized antenna array |
-
1986
- 1986-07-19 JP JP61169033A patent/JPS6326508A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005335712A (ja) * | 2004-05-24 | 2005-12-08 | Chuoh Pack Industry Co Ltd | ワイヤレス段ボールケース |
JP2007317972A (ja) * | 2006-05-29 | 2007-12-06 | Hitachi High-Technologies Corp | 電子部品の貼付状態検査装置 |
CN103471511A (zh) * | 2013-09-23 | 2013-12-25 | 马晓璐 | 一种包裹尺寸测量仪 |
US11777228B2 (en) * | 2019-12-09 | 2023-10-03 | Nxp Usa, Inc. | Multi-polarized antenna array |
Also Published As
Publication number | Publication date |
---|---|
JPH0367567B2 (ko) | 1991-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS60219504A (ja) | 基板上の回路素子の高さ測定装置 | |
JPH0572961B2 (ko) | ||
JP2953736B2 (ja) | 半田の形状検査方法 | |
US7664311B2 (en) | Component mounting board inspecting apparatus | |
JP2003222598A (ja) | 曲面体の表面状態検査方法および基板検査装置 | |
EP0265769B1 (en) | Method and apparatus for measuring with an optical cutting beam | |
JPS6326508A (ja) | 実装部品検査装置 | |
JP2996263B2 (ja) | 異物検出用の最適閾値決定方法 | |
JPS6326510A (ja) | 実装部品検査装置 | |
JPH08181421A (ja) | プリント配線板及びプリント配線板検査装置 | |
JPH0367568B2 (ko) | ||
JPS6250605A (ja) | 被検物検査装置 | |
JP4180127B2 (ja) | クリーム半田印刷検査装置およびクリーム半田印刷検査方法 | |
JPS63229311A (ja) | 断面形状検知方法 | |
JPS6168676A (ja) | プリント板部品実装検査方法 | |
JPH09318553A (ja) | 基板の検査方法 | |
JPS6326511A (ja) | 実装部品検査装置 | |
JPH05322532A (ja) | ボンディングワイヤの外観検査装置及び外観検査方法 | |
JP2765338B2 (ja) | チップ部品実装検査装置 | |
JPH0658729A (ja) | 半田付け状態検査装置 | |
JP2701872B2 (ja) | 面付パターンの欠陥検査装置 | |
JP2821047B2 (ja) | 2値化閾値の設定方法 | |
JPS62299705A (ja) | 実装部品検査装置 | |
JPH0654223B2 (ja) | 印刷配線基板のはんだ付検査装置及びその検査方法 | |
JPH0933225A (ja) | はんだ付外観の検査装置および検査方法 |