JPS6325706B2 - - Google Patents
Info
- Publication number
- JPS6325706B2 JPS6325706B2 JP58113219A JP11321983A JPS6325706B2 JP S6325706 B2 JPS6325706 B2 JP S6325706B2 JP 58113219 A JP58113219 A JP 58113219A JP 11321983 A JP11321983 A JP 11321983A JP S6325706 B2 JPS6325706 B2 JP S6325706B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- support
- electrodes
- voltage
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 7
- 238000009832 plasma treatment Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 description 12
- 238000000992 sputter etching Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11321983A JPS605539A (ja) | 1983-06-23 | 1983-06-23 | プラズマ処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11321983A JPS605539A (ja) | 1983-06-23 | 1983-06-23 | プラズマ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS605539A JPS605539A (ja) | 1985-01-12 |
JPS6325706B2 true JPS6325706B2 (US07413550-20080819-C00001.png) | 1988-05-26 |
Family
ID=14606589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11321983A Granted JPS605539A (ja) | 1983-06-23 | 1983-06-23 | プラズマ処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS605539A (US07413550-20080819-C00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0256242U (US07413550-20080819-C00001.png) * | 1988-10-19 | 1990-04-24 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH074718B2 (ja) * | 1986-06-04 | 1995-01-25 | キヤノン株式会社 | 静電吸着装置 |
JPH0645472B2 (ja) * | 1986-12-25 | 1994-06-15 | 大平洋金属株式会社 | 耐熱性、耐アルカリ性、低pH性に優れた無機質繊維の製造方法 |
JP3015899B2 (ja) * | 1988-01-12 | 2000-03-06 | 住友金属工業株式会社 | 静電チャックにおける被吸着物の離脱方法 |
JP2651597B2 (ja) * | 1988-06-27 | 1997-09-10 | 富士通株式会社 | ドライエッチング方法及び装置 |
US5665167A (en) * | 1993-02-16 | 1997-09-09 | Tokyo Electron Kabushiki Kaisha | Plasma treatment apparatus having a workpiece-side electrode grounding circuit |
KR102056724B1 (ko) * | 2017-03-21 | 2019-12-17 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라스마 처리 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227266A (en) * | 1975-08-25 | 1977-03-01 | Hitachi Ltd | Wafer support |
-
1983
- 1983-06-23 JP JP11321983A patent/JPS605539A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227266A (en) * | 1975-08-25 | 1977-03-01 | Hitachi Ltd | Wafer support |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0256242U (US07413550-20080819-C00001.png) * | 1988-10-19 | 1990-04-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS605539A (ja) | 1985-01-12 |
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