JPS6323892Y2 - - Google Patents
Info
- Publication number
- JPS6323892Y2 JPS6323892Y2 JP3102782U JP3102782U JPS6323892Y2 JP S6323892 Y2 JPS6323892 Y2 JP S6323892Y2 JP 3102782 U JP3102782 U JP 3102782U JP 3102782 U JP3102782 U JP 3102782U JP S6323892 Y2 JPS6323892 Y2 JP S6323892Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip jumper
- chip
- solder
- jumper element
- element body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102782U JPS58133954U (ja) | 1982-03-05 | 1982-03-05 | チツプジヤンパ素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102782U JPS58133954U (ja) | 1982-03-05 | 1982-03-05 | チツプジヤンパ素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58133954U JPS58133954U (ja) | 1983-09-09 |
| JPS6323892Y2 true JPS6323892Y2 (ko) | 1988-06-30 |
Family
ID=30042719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3102782U Granted JPS58133954U (ja) | 1982-03-05 | 1982-03-05 | チツプジヤンパ素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58133954U (ko) |
-
1982
- 1982-03-05 JP JP3102782U patent/JPS58133954U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58133954U (ja) | 1983-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR860000188B1 (ko) | 혼성집적회로 부품 및 그 부착 방법 | |
| JPH0669005B2 (ja) | 多層シ−トコイル | |
| JPH0593069U (ja) | プリント回路基板 | |
| KR100442410B1 (ko) | 배선기판 단자접속구조 | |
| JPH071821B2 (ja) | 配線基板 | |
| JPS6323892Y2 (ko) | ||
| JPH0528066U (ja) | 多層基板とフレキシブル基板との取付構造 | |
| JPH0218594B2 (ko) | ||
| JPS6141272Y2 (ko) | ||
| JPS635248Y2 (ko) | ||
| JPH04217388A (ja) | 印刷配線板 | |
| JPS6352795B2 (ko) | ||
| JPH0132734Y2 (ko) | ||
| JPH0747901Y2 (ja) | 印刷配線板 | |
| JPH046212Y2 (ko) | ||
| JPH0519974Y2 (ko) | ||
| JPH0445251Y2 (ko) | ||
| JPH0217954B2 (ko) | ||
| JP2572415Y2 (ja) | 金属ベース回路基板と外部リード線との接続装置 | |
| JPH0440283Y2 (ko) | ||
| JPH0741178Y2 (ja) | 厚膜混成集積回路基板 | |
| JPS6236316Y2 (ko) | ||
| JPH0528917B2 (ko) | ||
| JPH0356068Y2 (ko) | ||
| JPH04243187A (ja) | プリント基板 |