JPS6323892Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a chip jumper element used when mounting and assembling circuit elements on a circuit pattern of a printed circuit board or the like.

In general, chip jumper elements are used as electrical connection elements between circuit patterns when chip-type circuit elements are mounted and assembled on circuit patterns such as printed circuit boards.

As a conventional chip jumper element of this type,
For example, an insulating layer is coated on the surface of a thin plate-like material made of a conductive material such as copper, which is cut to a certain length to form the element body, and both ends of the cut surface are configured as conductive terminals. There is something. When such a chip jumper element is mounted on a circuit pattern of a printed circuit board, as shown in FIG.
Temporarily position and place the chip jumper element with a solder dip.
A method is used in which solders 5 and 6 are formed on a and 1b, respectively, and connected to the circuit patterns 3 and 4.

However, the size of the chip jumper element is small, for example, 1.6, 3.2 in vertical and horizontal dimensions.
(m/m), so when installing using a conventional chip jumper element,
The chip jumper element 1 easily floats in the direction of the arrow in FIG. 1 when it is soldered and attached to the circuit pattern. When the chip jumper element 1 is temporarily positioned between circuit patterns, as shown in FIG. 2, if the chip jumper element 1 is misaligned on one side of the circuit pattern, solder breakage, etc. may occur due to the floating problem mentioned above. There was a drawback in that the reliability of soldering became extremely poor due to the floating and positional displacement of these chip jumper elements.

This idea was made in view of the above points, and its purpose is to provide a solder groove extending between both ends of the element body, thereby reducing the effects of misalignment and lifting that occur when attaching to a circuit pattern. To provide a chip jumper element capable of performing reliable soldering without being soldered.

Hereinafter, embodiments of this invention will be described with reference to the drawings.

FIG. 3 is an enlarged perspective view showing a chip jumper element according to an embodiment of the invention. This chip jumper element consists of a chip-type element body 11 made of a conductive material such as copper, an insulating layer 12 made of an enamel layer or the like coated on the surface of the element body 11, and a chip-type element body 11 formed on the upper surface of the element body 11 between both ends thereof. It has a structure in which both ends are configured as conductive terminal parts 11a and 11b, and the other peripheral parts are electrically insulated by an insulating layer 12. The insulating layer 12 also serves to prevent oxidation of the element body 11, and the solder groove 13 is formed in this insulating layer 1.
It is formed deeper than 2. Preferably, the conductive terminal portions 11a and 11b at both ends are subjected to a preliminary soldering process.

The means for forming such a chip jumper element will be explained based on FIG. 4. In this method, the surface of a long material 20 made of a thin plate-like conductive material is first coated with an insulating layer, and then the longitudinal direction of the upper surface is covered with an insulating layer. After forming the solder groove 21 along the direction, it is connected to each cut portion 2.
By cutting to a certain length at step 2, the chip jumper element 10 having the structure shown in FIG. 3 can be formed.

According to the configuration of the above embodiment, when the chip jumper element 10 is soldered and fixed onto the circuit pattern, as shown in FIG.
0 is placed between the circuit patterns 3 and 4 of the printed circuit board 2, and is temporarily adhered to the printed circuit board 2 with an adhesive 15. Next, the printed circuit board 2 to which the chip jumper element 10 is bonded is immersed in a solder dip bath, and solder 5,
6 and the solder 14 that bridges them together as shown in the figure. Therefore, as in the conventional case, the chip jumper element 10 may float after soldering between the circuit patterns 3 and 4, and as shown in FIG.
Even if a positional shift occurs on either side of the circuit patterns 3, 4, the solder 14 in the groove 13 is bridged to ensure the solder connection, and the reliability of the soldering surface can be improved.

In addition, although the above-mentioned embodiment shows the case where one solder groove is provided on the top surface of the element body, it is also possible to provide the solder groove on a side surface other than the top surface, the bottom surface, or to provide a plurality of solder grooves. .

As explained above, according to the chip jumper element of this invention, by providing a solder groove extending over both ends of the element body, soldering between circuit patterns can be reliably performed. Therefore, the reliability of the soldering surface can be improved.

[Brief explanation of the drawing]

1 and 2 are partial cross-sectional views and top views for explaining the means for attaching a conventional chip jumper element to a circuit pattern, and FIG. 3 is an enlarged perspective view of a chip jumper element according to an embodiment of the invention.
4 is a perspective view for explaining the means for forming the chip jumper element shown in FIG. 3, and FIGS. 5 and 6 are partial cross-sectional views for explaining the means for attaching the chip jumper element to the circuit pattern shown in FIG. 3. FIG. 3 is a diagram and a top view. 11...Element body, 11a, 11b...Conductive terminal portion, 12...Insulating layer, 13...Solder groove.

Claims (1)

[Scope of utility model registration request] A chip jumper element in which both ends of an element body made of a conductive material are configured as conductive terminal parts, characterized in that at least one solder groove is formed on a surface of the element body extending between the both ends. .