JPS63234537A - 半導体装置のばり取り方法及びその装置 - Google Patents

半導体装置のばり取り方法及びその装置

Info

Publication number
JPS63234537A
JPS63234537A JP6990687A JP6990687A JPS63234537A JP S63234537 A JPS63234537 A JP S63234537A JP 6990687 A JP6990687 A JP 6990687A JP 6990687 A JP6990687 A JP 6990687A JP S63234537 A JPS63234537 A JP S63234537A
Authority
JP
Japan
Prior art keywords
liquid
semiconductor device
water
tank
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6990687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463541B2 (enExample
Inventor
Masahide Kudo
工藤　眞秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6990687A priority Critical patent/JPS63234537A/ja
Publication of JPS63234537A publication Critical patent/JPS63234537A/ja
Publication of JPH0463541B2 publication Critical patent/JPH0463541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0077—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping removing burrs or flashes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP6990687A 1987-03-24 1987-03-24 半導体装置のばり取り方法及びその装置 Granted JPS63234537A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6990687A JPS63234537A (ja) 1987-03-24 1987-03-24 半導体装置のばり取り方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6990687A JPS63234537A (ja) 1987-03-24 1987-03-24 半導体装置のばり取り方法及びその装置

Publications (2)

Publication Number Publication Date
JPS63234537A true JPS63234537A (ja) 1988-09-29
JPH0463541B2 JPH0463541B2 (enExample) 1992-10-12

Family

ID=13416209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6990687A Granted JPS63234537A (ja) 1987-03-24 1987-03-24 半導体装置のばり取り方法及びその装置

Country Status (1)

Country Link
JP (1) JPS63234537A (enExample)

Also Published As

Publication number Publication date
JPH0463541B2 (enExample) 1992-10-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees