JPS6323258U - - Google Patents
Info
- Publication number
- JPS6323258U JPS6323258U JP11771986U JP11771986U JPS6323258U JP S6323258 U JPS6323258 U JP S6323258U JP 11771986 U JP11771986 U JP 11771986U JP 11771986 U JP11771986 U JP 11771986U JP S6323258 U JPS6323258 U JP S6323258U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor device
- carrier tape
- packaging
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
Description
第１図ａは本考案の第１の実施例の平面図、第
１図ｂは同図ａのＡ―Ａ′線における断面図、第
２図ａは本考案の第２の実施例の平面図、第２図
ｂは同図ａのＢ―Ｂ′線における断面図、第３図
ａは従来の半導体装置包装用部材の一例を示す平
面図、第３図ｂは同図ａのＣ―Ｃ′線における断
面図、第４図及び第５図は従来の半導体装置包装
用部材とテープリール及び熱圧着用アイロンとの
関係の一例を示す斜視図及び断面図である。
１，１１……キヤビテイ、２，８，１２……キ
ヤリアテープ、３，１３……カバーテープ、４，
１４……半導体装置、５，１５……送り穴、６，
１６……熱圧着部、７，９……突起部、１７……
テープリール、１８……熱圧着用アイロン。
Fig. 1a is a plan view of the first embodiment of the present invention, Fig. 1b is a sectional view taken along the line A-A' in Fig. 1a, and Fig. 2a is a plan view of the second embodiment of the invention. Figure 2b is a sectional view taken along line B-B' in figure a, Figure 3a is a plan view showing an example of a conventional semiconductor device packaging member, and Figure 3b is C-- in figure a. A sectional view taken along line C', and FIGS. 4 and 5 are a perspective view and a sectional view showing an example of the relationship between a conventional semiconductor device packaging member, a tape reel, and a thermocompression iron. 1, 11... Cavity, 2, 8, 12... Carrier tape, 3, 13... Cover tape, 4,
14... Semiconductor device, 5, 15... Sprocket hole, 6,
16...Thermocompression bonding part, 7, 9...Protrusion part, 17...
Tape reel, 18... Iron for heat compression.
Claims (1)
するキヤリアテープと、該キヤリアテープの前記
キヤビテイをシールするカバーテープと、前記キ
ヤリアテープならびに前記カバーテープを巻取る
リールとからなるテープとリール方式の半導体装
置包装用部材において、前記キヤリアテープの上
面に設けられ前記カバーテープの位置決めを行う
突起部を備えることを特徴とする半導体装置包装
用部材。 A tape and reel type semiconductor device packaging comprising a carrier tape having a continuous cavity for accommodating a semiconductor device, a cover tape for sealing the cavity of the carrier tape, and a reel for winding the carrier tape and the cover tape. A member for packaging a semiconductor device, comprising a protrusion provided on the upper surface of the carrier tape for positioning the cover tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11771986U JPS6323258U (en) | 1986-07-30 | 1986-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11771986U JPS6323258U (en) | 1986-07-30 | 1986-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6323258U true JPS6323258U (en) | 1988-02-16 |
Family
ID=31003497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11771986U Pending JPS6323258U (en) | 1986-07-30 | 1986-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323258U (en) |
-
1986
- 1986-07-30 JP JP11771986U patent/JPS6323258U/ja active Pending