JPH0188861U - - Google Patents

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Publication number
JPH0188861U
JPH0188861U JP18250687U JP18250687U JPH0188861U JP H0188861 U JPH0188861 U JP H0188861U JP 18250687 U JP18250687 U JP 18250687U JP 18250687 U JP18250687 U JP 18250687U JP H0188861 U JPH0188861 U JP H0188861U
Authority
JP
Japan
Prior art keywords
chip
electronic components
carrier
shaped electronic
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18250687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18250687U priority Critical patent/JPH0188861U/ja
Publication of JPH0188861U publication Critical patent/JPH0188861U/ja
Pending legal-status Critical Current

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  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例を示す平面図、第
1図bは第1図aのA−A′線断面図、第2図a
は従来のキヤリアテーピングを示す平面図、第2
図bは第2図aのB−B′線断面図である。 1a,1b……チツプ形電子部品、2……キヤ
リアテープ、2a……エンボス、3……カバーテ
ープ。
Figure 1a is a plan view showing an embodiment of the present invention, Figure 1b is a sectional view taken along line A-A' in Figure 1a, Figure 2a is
is a plan view showing conventional carrier taping;
FIG. b is a sectional view taken along line B-B' in FIG. 2a. 1a, 1b... Chip-shaped electronic component, 2... Carrier tape, 2a... Emboss, 3... Cover tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チツプ形電子部品をキヤリアテープに収納し、
カバーテープにより封止し、リールに巻き取つた
キヤリアテーピング梱包体において、前記キヤリ
アテープのエンボス内に、複数個のチツプ形電子
部品を収納したことを特徴とするチツプ形電子部
品のキヤリアテーピング梱包体。
Chip-shaped electronic components are stored in carrier tape,
A carrier taping package for chip-shaped electronic components, characterized in that the carrier taping package is sealed with a cover tape and wound on a reel, and a plurality of chip-shaped electronic components are housed within the embossments of the carrier tape. .
JP18250687U 1987-11-30 1987-11-30 Pending JPH0188861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18250687U JPH0188861U (en) 1987-11-30 1987-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18250687U JPH0188861U (en) 1987-11-30 1987-11-30

Publications (1)

Publication Number Publication Date
JPH0188861U true JPH0188861U (en) 1989-06-12

Family

ID=31473953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18250687U Pending JPH0188861U (en) 1987-11-30 1987-11-30

Country Status (1)

Country Link
JP (1) JPH0188861U (en)

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