JPH0188862U - - Google Patents
Info
- Publication number
- JPH0188862U JPH0188862U JP18250787U JP18250787U JPH0188862U JP H0188862 U JPH0188862 U JP H0188862U JP 18250787 U JP18250787 U JP 18250787U JP 18250787 U JP18250787 U JP 18250787U JP H0188862 U JPH0188862 U JP H0188862U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped electronic
- electronic components
- carrier tape
- taping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａは本考案の第１の実施例を示すチツプ
形電子部品のテーピング品を示す平面図、第１図
ｂは第１図ａのＡ−Ａ′線断面図、第２図ａ、第
３図ａ、第４図ａは本考案の他の実施例を示すチ
ツプ形電子部品のテーピング品を示す平面図、第
２図ｂは第２図ａのＡ−Ａ′線断面図、第３図ｂ
は第３図ａのＡ−Ａ′線断面図、第４図ｂは第４
図ａのＡ−Ａ′線断面図、第５図ａは従来のチツ
プ形電子部品のテーピング品を示す平面図、第５
図ｂは第５図ａのＡ−Ａ′線断面図である。
１……キヤリアテープ、２ａ１，２ａ２，２ａ
３……エンボス、３ａ，３ｂ，３ｃ……チツプ形
電子部品、４……カバーテープ。
FIG. 1a is a plan view showing a taped chip-shaped electronic component according to the first embodiment of the present invention, FIG. 1b is a sectional view taken along line A-A' in FIG. 1a, FIG. 3a and 4a are plan views showing taped chip-shaped electronic components according to other embodiments of the present invention, and FIG. 2b is a sectional view taken along the line A-A' in FIG. Figure 3b
is a sectional view taken along the line A-A' in Figure 3a, and Figure 4b is a cross-sectional view taken along line A-A' in Figure 3a.
Fig. 5a is a sectional view taken along the line A-A' in Fig. 5a;
FIG. 5b is a sectional view taken along line A-A' in FIG. 5a. 1...Carrier tape, 2a 1 , 2a 2 , 2a
3 ... Emboss, 3a, 3b, 3c... Chip-shaped electronic components, 4... Cover tape.
Claims (1)
カバーテープにより封止し、リールに巻き取つた
テーピング梱包体において、前記キヤリアテープ
のエンボス内に、外形寸法の異なる複数個のチツ
プ形電子部品を収納したことを特徴とするチツプ
形電子部品のテーピング梱包体。 Chip-shaped electronic components are stored in carrier tape,
Taping of a chip-shaped electronic component, characterized in that a plurality of chip-shaped electronic components having different external dimensions are housed within the embossment of the carrier tape in a taping package sealed with a cover tape and wound on a reel. packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250787U JPH0188862U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250787U JPH0188862U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0188862U true JPH0188862U (en) | 1989-06-12 |
Family
ID=31473954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18250787U Pending JPH0188862U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0188862U (en) |
-
1987
- 1987-11-30 JP JP18250787U patent/JPH0188862U/ja active Pending
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