JPH0432963U - - Google Patents

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Publication number
JPH0432963U
JPH0432963U JP7352490U JP7352490U JPH0432963U JP H0432963 U JPH0432963 U JP H0432963U JP 7352490 U JP7352490 U JP 7352490U JP 7352490 U JP7352490 U JP 7352490U JP H0432963 U JPH0432963 U JP H0432963U
Authority
JP
Japan
Prior art keywords
tape
semiconductor device
recess
storing
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7352490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7352490U priority Critical patent/JPH0432963U/ja
Publication of JPH0432963U publication Critical patent/JPH0432963U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例の斜視図、第2
図は半導体装置を収納した状態の斜視図、第3図
はその断面図、第4図、第5図は従来例に半導体
装置を収納しカバーテープでシールした状態を示
す斜視図及び断面図、第6図は第2の実施例の斜
視図である。 1……テープ、2……凹み、3−1〜3−5…
…半導体装置固定用のタブ、3−2a……タブ用
に引き出されたため発生した空隙、4……半導体
装置、5……突き上げ孔、6……カバーテープ。
Fig. 1 is a perspective view of the first embodiment of the present invention;
The figure is a perspective view of a state in which a semiconductor device is housed, FIG. 3 is a sectional view thereof, and FIGS. 4 and 5 are perspective views and sectional views showing a state in which a semiconductor device is housed in a conventional example and sealed with a cover tape, FIG. 6 is a perspective view of the second embodiment. 1...tape, 2...dent, 3-1 to 3-5...
...Tab for fixing semiconductor device, 3-2a...Gap caused by being pulled out for tab, 4...Semiconductor device, 5...Push-up hole, 6...Cover tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] テープにエンボス加工を施して、半導体装置を
収納する凹みを設けた半導体装置収納用キヤリア
テープにおいて、前記凹みの上部に、半導体装置
を固定するタブを設けたことを特徴とする半導体
装置収納用キヤリアテープ。
A carrier tape for storing semiconductor devices, the tape being embossed to provide a recess for storing the semiconductor device, characterized in that a tab for fixing the semiconductor device is provided above the recess. tape.
JP7352490U 1990-07-11 1990-07-11 Pending JPH0432963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7352490U JPH0432963U (en) 1990-07-11 1990-07-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7352490U JPH0432963U (en) 1990-07-11 1990-07-11

Publications (1)

Publication Number Publication Date
JPH0432963U true JPH0432963U (en) 1992-03-17

Family

ID=31612411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7352490U Pending JPH0432963U (en) 1990-07-11 1990-07-11

Country Status (1)

Country Link
JP (1) JPH0432963U (en)

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