JPH0480890U - - Google Patents
Info
- Publication number
- JPH0480890U JPH0480890U JP12412790U JP12412790U JPH0480890U JP H0480890 U JPH0480890 U JP H0480890U JP 12412790 U JP12412790 U JP 12412790U JP 12412790 U JP12412790 U JP 12412790U JP H0480890 U JPH0480890 U JP H0480890U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- embossed
- packaging container
- tape
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims 2
Landscapes
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａは本考案の第１実施例に表面実装型半
導体装置を収納した状態の断面図、同図ｂは同図
ａのＡ−Ａ矢視断面図、第２図ａは本考案の第２
実施例と収納半導体装置を示す断面図、同図ｂは
同図ａのＡ−Ａ矢視断面図、第３図は従来の半導
体装置の包装容器に半導体装置を収納した状態の
断面図である。
１，１ａ，１１……エンボスキヤリアテープ、
２……エンボス凹所、３，３ａ……凸起、４……
カバーテープ、５……平面実装型半導体装置。
Figure 1a is a cross-sectional view of the first embodiment of the present invention in which a surface-mounted semiconductor device is housed, Figure b is a cross-sectional view taken along the line A-A in Figure a, and Figure 2a is a cross-sectional view of the present invention. Second
FIG. 3 is a cross-sectional view showing an embodiment and a semiconductor device stored therein, FIG. . 1, 1a, 11... Embossed carrier tape,
2...Embossed recess, 3,3a...Protrusion, 4...
Cover tape, 5...Flat-mounted semiconductor device.
Claims (1)
がテープ長さの方向に一列に並んで形成されたエ
ンボスキヤリアテープと、前記エンボス凹所の上
部開口を塞ぐカバーテープとからなる半導体装置
の包装容器において、前記エンボス凹所の底部に
は、収納半導体装置のパツケージ底面の受け台と
なる凸起が形成されていることを特徴とする半導
体装置の包装容器。 A semiconductor device packaging container comprising an embossed carrier tape in which embossed recesses for accommodating a surface-mounted semiconductor device are formed in a row in the tape length direction, and a cover tape that closes an upper opening of the embossed recesses. . A packaging container for semiconductor devices, characterized in that the bottom of the embossed recess is formed with a protrusion that serves as a cradle for the bottom surface of the package of the semiconductor device to be stored.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12412790U JPH0480890U (en) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12412790U JPH0480890U (en) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480890U true JPH0480890U (en) | 1992-07-14 |
Family
ID=31871795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12412790U Pending JPH0480890U (en) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480890U (en) |
-
1990
- 1990-11-26 JP JP12412790U patent/JPH0480890U/ja active Pending
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