JPH0478188U - - Google Patents
Info
- Publication number
- JPH0478188U JPH0478188U JP12150990U JP12150990U JPH0478188U JP H0478188 U JPH0478188 U JP H0478188U JP 12150990 U JP12150990 U JP 12150990U JP 12150990 U JP12150990 U JP 12150990U JP H0478188 U JPH0478188 U JP H0478188U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bag
- container
- enclosing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000002274 desiccant Substances 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 description 2
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の第１実施例にマガジンケース
を収納した状態の一部破裁斜視図、第２図は本考
案の第２実施例に半導体装置を収納した状態の断
面図、第３図は従来のエンボスキヤリアテープに
半導体装置を収納した状態の断面図、第４図は従
来のビニール袋にマガジンケースを収納した状態
を示す斜視図である。
１，１ａ……ビニール袋、２，２ａ……乾燥材
、３……マガジンケース、４……エンボステープ
、５……カバーテープ、６……テープ状乾燥材、
７……半導体装置。
FIG. 1 is a partially broken perspective view of the first embodiment of the present invention with a magazine case stored in it, FIG. 2 is a sectional view of the second embodiment of the present invention with a semiconductor device stored in it, and FIG. The figure is a cross-sectional view of a conventional embossed carrier tape with a semiconductor device stored therein, and FIG. 4 is a perspective view of a conventional plastic bag with a magazine case stored therein. 1, 1a... Plastic bag, 2, 2a... Drying material, 3... Magazine case, 4... Embossed tape, 5... Cover tape, 6... Tape-shaped drying material,
7...Semiconductor device.
Claims (1)
どからなる半導体装置の包装用部材において、前
記袋または容器などの内面の少くとも一部に乾燥
材が一体的に設けられていることを特徴とする半
導体装置の包装用部材。 A semiconductor device packaging member comprising a bag or a container for enclosing a semiconductor device, characterized in that a desiccant material is integrally provided on at least a part of the inner surface of the bag or container. packaging materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150990U JPH0478188U (en) | 1990-11-20 | 1990-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150990U JPH0478188U (en) | 1990-11-20 | 1990-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0478188U true JPH0478188U (en) | 1992-07-08 |
Family
ID=31869362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12150990U Pending JPH0478188U (en) | 1990-11-20 | 1990-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0478188U (en) |
-
1990
- 1990-11-20 JP JP12150990U patent/JPH0478188U/ja active Pending